Invention Grant
US08691705B2 Method of patterning metal alloy material layer having hafnium and molybdenum
有权
具有铪和钼的金属合金材料层的图形化方法
- Patent Title: Method of patterning metal alloy material layer having hafnium and molybdenum
- Patent Title (中): 具有铪和钼的金属合金材料层的图形化方法
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Application No.: US13118604Application Date: 2011-05-31
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Publication No.: US08691705B2Publication Date: 2014-04-08
- Inventor: Chih-Wei Huang , Chao-Sung Lai , Hsing-Kan Peng , Chung-Yuan Lee , Shian-Jyh Lin
- Applicant: Chih-Wei Huang , Chao-Sung Lai , Hsing-Kan Peng , Chung-Yuan Lee , Shian-Jyh Lin
- Applicant Address: TW Taoyuan
- Assignee: Nanya Technology Corporation
- Current Assignee: Nanya Technology Corporation
- Current Assignee Address: TW Taoyuan
- Agency: Jianq Chyun IP Office
- Priority: TW96146920A 20071207
- Main IPC: H01L21/302
- IPC: H01L21/302 ; H01L21/461
Abstract:
A method of patterning a metal alloy material layer having hafnium and molybdenum. The method includes forming a patterned mask layer on a metal alloy material layer having hafnium and molybdenum on a substrate. The patterned mask layer is used as a mask and an etching process is performed using an etchant on the metal alloy material layer having hafnium and molybdenum so as to form a metal alloy layer having hafnium and molybdenum. The etchant includes at least nitric acid, hydrofluoric acid and sulfuric acid. The patterned mask layer is removed.
Public/Granted literature
- US20110226736A1 METHOD OF PATTERNING METAL ALLOY MATERIAL LAYER HAVING HAFNIUM AND MOLYBDENUM Public/Granted day:2011-09-22
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