Provided is a semiconductor package. The semiconductor package includes an insulation substrate with top and bottom surfaces. The semiconductor package further includes a circuit pattern on the top surface. The circuit pattern includes a first signal conductive pattern and first and second ground conductive patterns. The semiconductor package includes a first insulation film covering the first signal conductive pattern and exposing a first portion of the first ground conductive pattern and a portion of the second ground conductive pattern. The semiconductor package further includes a first conductive member on the first signal conductive pattern and the first and second ground conductive patterns. The first conductive member electrically connects the first and second ground conductive patterns by covering a portion of the first insulation film and coming in contact with the first portion of the first ground conductive pattern and the portion of the second ground conductive pattern.