Invention Grant
- Patent Title: Dummy shoulder structure for line stress reduction
- Patent Title (中): 用于线应力降低的假肩结构
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Application No.: US12753272Application Date: 2010-04-02
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Publication No.: US08692351B2Publication Date: 2014-04-08
- Inventor: Cheng Cheng Kuo , Luke Lo , Minghsing Tsai , Ken-Yu Chang , Jye-Yen Cheng , Jeng-Shiun Ho , Hua-Tai Lin , Chih-Hsiang Yao
- Applicant: Cheng Cheng Kuo , Luke Lo , Minghsing Tsai , Ken-Yu Chang , Jye-Yen Cheng , Jeng-Shiun Ho , Hua-Tai Lin , Chih-Hsiang Yao
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Haynes and Boone, LLP
- Main IPC: H01L21/70
- IPC: H01L21/70

Abstract:
Semiconductor integrated circuit line structures for improving a process window in the vicinity of dense-to-isolated pattern transition areas and a technique to implement the line structures in the layout process are described in this disclosure. The disclosed structure includes a semiconductor substrate, and a material layer above the substrate. The material layer has a closely spaced dense line structure, an isolated line structure next to the dense line structure, and a dummy line shoulder structure formed in the vicinity of the dense line and the isolated line structures. One end of the dummy line shoulder structure connects to the isolated line structure and another end extends away from the isolated line structure in an orientation substantially perpendicular to the isolated line structure.
Public/Granted literature
- US20110241207A1 DUMMY SHOULDER STRUCTURE FOR LINE STRESS REDUCTION Public/Granted day:2011-10-06
Information query
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