Invention Grant
US08697242B2 Glass member provided with sealing material layer, electronic device using it and process for producing the electronic device
有权
设置有密封材料层的玻璃构件,使用其的电子装置和用于制造电子装置的方法
- Patent Title: Glass member provided with sealing material layer, electronic device using it and process for producing the electronic device
- Patent Title (中): 设置有密封材料层的玻璃构件,使用其的电子装置和用于制造电子装置的方法
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Application No.: US13341188Application Date: 2011-12-30
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Publication No.: US08697242B2Publication Date: 2014-04-15
- Inventor: Sohei Kawanami , Atsuo Hiroi
- Applicant: Sohei Kawanami , Atsuo Hiroi
- Applicant Address: JP Tokyo
- Assignee: Asahi Glass Company, Limited
- Current Assignee: Asahi Glass Company, Limited
- Current Assignee Address: JP Tokyo
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2009-154954 20090630; JP2010-015143 20100127
- Main IPC: B32B15/04
- IPC: B32B15/04 ; B32B17/06 ; H05B6/02 ; B05D3/06

Abstract:
The invention provides a glass member provided with a sealing material layer, which suppresses generation of failures such as cracks or breakage of glass substrates or a sealing layer even when the distance between two glass substrates is narrowed, and thereby makes it possible to improve the sealing property between the glass substrates and its reliability. A glass substrate has a surface provided with a sealing region, on which a sealing material layer having a thickness of at most 15 μm is formed. The sealing material layer includes a fired material of a glass material for sealing containing a sealing glass, a laser absorbent and optionally a low-expansion filler, wherein the total content of the laser absorbent and the low-expansion filler being the optional component in the glass material for sealing is within the range of from 2 to 44 vol %.
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