Invention Grant
- Patent Title: Slit recess channel gate
- Patent Title (中): 狭缝凹槽通道门
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Application No.: US13958620Application Date: 2013-08-05
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Publication No.: US08698235B2Publication Date: 2014-04-15
- Inventor: Tieh-Chiang Wu , Yi-Nan Chen , Hsien-Wen Liu
- Applicant: Nanya Technology Corp.
- Applicant Address: TW Kueishan, Tao-Yuan Hsien
- Assignee: Nanya Technology Corp.
- Current Assignee: Nanya Technology Corp.
- Current Assignee Address: TW Kueishan, Tao-Yuan Hsien
- Agent Winston Hsu; Scott Margo
- Main IPC: H01L29/66
- IPC: H01L29/66 ; H01L21/8238

Abstract:
A slit recess channel gate is provided. The slit recess channel gate includes a substrate, a gate dielectric layer, a first conductive layer and a second conductive layer. The substrate has a first trench. The gate dielectric layer is disposed on a surface of the first trench and the first conductive layer is embedded in the first trench. The second conductive layer is disposed on the first conductive layer and aligned with the first conductive layer above the main surface, wherein a bottom surface area of the second conductive layer is substantially smaller than a top surface area of the second conductive layer.
Public/Granted literature
- US20130307067A1 Slit Recess Channel Gate Public/Granted day:2013-11-21
Information query
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