Invention Grant
- Patent Title: Semiconductor device
- Patent Title (中): 半导体器件
-
Application No.: US13156352Application Date: 2011-06-09
-
Publication No.: US08698247B2Publication Date: 2014-04-15
- Inventor: Chih-Chung Wang , Wei-Lun Hsu , Te-Yuan Wu , Wen-Fang Lee , Ke-Feng Lin , Shan-Shi Huang , Ming-Tsung Lee
- Applicant: Chih-Chung Wang , Wei-Lun Hsu , Te-Yuan Wu , Wen-Fang Lee , Ke-Feng Lin , Shan-Shi Huang , Ming-Tsung Lee
- Applicant Address: TW Science-Based Industrial Park, Hsin-Chu
- Assignee: United Microelectronics Corp.
- Current Assignee: United Microelectronics Corp.
- Current Assignee Address: TW Science-Based Industrial Park, Hsin-Chu
- Agent Winston Hsu; Scott Margo
- Main IPC: H01L23/62
- IPC: H01L23/62

Abstract:
The present invention provides a semiconductor device including a substrate, a deep well, a high-voltage well, and a doped region. The substrate and the high-voltage well have a first conductive type, and the deep well and the doped region have a second conductive type different from the first conductive type. The substrate has a high-voltage region and a low-voltage region, and the deep well is disposed in the substrate in the high-voltage region. The high-voltage well is disposed in the substrate between the high-voltage region and the low-voltage region, and the doped region is disposed in the high-voltage well. The doped region and the high-voltage well are electrically connected to a ground.
Public/Granted literature
- US20120313175A1 SEMICONDUCTOR DEVICE Public/Granted day:2012-12-13
Information query
IPC分类: