Invention Grant
- Patent Title: Thermal management of stacked semiconductor chips with electrically non-functional interconnects
- Patent Title (中): 具有电功能互连的堆叠半导体芯片的热管理
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Application No.: US13436066Application Date: 2012-03-30
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Publication No.: US08704353B2Publication Date: 2014-04-22
- Inventor: Michael Su , Bryan Black , Neil McLellan , Joe Siegel , Michael Alfano
- Applicant: Michael Su , Bryan Black , Neil McLellan , Joe Siegel , Michael Alfano
- Applicant Address: US CA Sunnyvale
- Assignee: Advanced Micro Devices, Inc.
- Current Assignee: Advanced Micro Devices, Inc.
- Current Assignee Address: US CA Sunnyvale
- Agent Timothy M. Honeycutt
- Main IPC: H01L23/02
- IPC: H01L23/02
Abstract:
A method of manufacturing is provided that includes fabricating a first plurality of electrically functional interconnects on a front side of a first semiconductor chip and fabricating a first plurality of electrically non-functional interconnects on a back side of the first semiconductor chip. Additional chips may be stacked on the first semiconductor chip.
Public/Granted literature
- US20130256872A1 THERMAL MANAGEMENT OF STACKED SEMICONDUCTOR CHIPS WITH ELECTRICALLY NON-FUNCTIONAL INTERCONNECTS Public/Granted day:2013-10-03
Information query
IPC分类:
