Invention Grant
- Patent Title: Intervertebral implant
- Patent Title (中): 椎间植入物
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Application No.: US13284650Application Date: 2011-10-28
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Publication No.: US08709085B2Publication Date: 2014-04-29
- Inventor: Beat Lechmann , Dominique Burkard , Claude Mathieu , Christopher Marden John Cain
- Applicant: Beat Lechmann , Dominique Burkard , Claude Mathieu , Christopher Marden John Cain
- Applicant Address: US MA Raynham
- Assignee: DePuy Synthes Products, LLC
- Current Assignee: DePuy Synthes Products, LLC
- Current Assignee Address: US MA Raynham
- Agency: Baker & Hostetler LLP
- Main IPC: A61F2/44
- IPC: A61F2/44

Abstract:
An intervertebral implant includes a three-dimensional body and a securing plate. The three-dimensional body includes a front surface and a rear surface. The three-dimensional body further includes a plurality of boreholes for accommodating fixation elements. The intervertebral implant also includes a front plate disposed at the front surface of the three-dimensional body and having a plurality of boreholes. A securing plate can be fastened to the front plate.
Public/Granted literature
- US20120101580A1 Intervertebral Implant Public/Granted day:2012-04-26
Information query
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