Method for producing a plastic layer having a layer thickness of less than 200 μm on an upper side of a substrate includes the following steps: applying plastic powder to the substrate upper side by means of a powder scattering device, then cleaning the substrate underside, then melting the applied plastic powder in a furnace, as a result of which the plastic layer is formed on the substrate, and cooling the substrate, wherein the substrate is transported continuously from method step to method step.