A method for collective fabrication of 3D electronic modules comprises: the fabrication of a stack of reconstructed wafers, comprising validated active components, this stack including a redistribution layer; the fabrication of a panel of validated passive printed circuits which comprises: fabrication of a panel of printed circuits, electrical testing of each printed circuit, fitting of the validated printed circuits to an adhesive substrate, molding of the mounted circuits in an electrically insulating resin, called coating resin and polymerization of the resin, removal of the adhesive substrate, a panel comprising only validated printed circuits being thus obtained; bonding the panel with a stack (of reconstructed wafers); cutting the “stack of panel” assembly for the purpose of obtaining the 3D electronic modules.