Invention Grant
- Patent Title: Semiconductor device structure and fabricating method thereof
- Patent Title (中): 半导体器件结构及其制造方法
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Application No.: US12852532Application Date: 2010-08-09
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Publication No.: US08716802B2Publication Date: 2014-05-06
- Inventor: Kai-Ling Chiu , Chih-Yu Tseng , Victor Chiang Liang , You-Ren Liu , Chih-Chen Hsueh
- Applicant: Kai-Ling Chiu , Chih-Yu Tseng , Victor Chiang Liang , You-Ren Liu , Chih-Chen Hsueh
- Applicant Address: TW Science-Based Industrial Park, Hsin-Chu
- Assignee: United Microelectronics Corp.
- Current Assignee: United Microelectronics Corp.
- Current Assignee Address: TW Science-Based Industrial Park, Hsin-Chu
- Agent Winston Hsu; Scott Margo
- Main IPC: H01L23/62
- IPC: H01L23/62

Abstract:
A semiconductor device structure including a substrate, a resistor, and a first gate structure is provided. The substrate includes a resistor region and a metal-oxide-semiconductor (MOS) transistor region. The resistor is disposed on the substrate within the resistor region. The resistor includes a first dielectric layer, a metal layer, a second dielectric layer, and a semiconductor layer sequentially stacked on the substrate. The first gate structure is disposed on the substrate within the MOS transistor region. The first gate structure includes the first dielectric layer, the metal layer, and the semiconductor layer sequentially stacked on the substrate.
Public/Granted literature
- US20100320540A1 SEMICONDUCTOR DEVICE STRUCTURE AND FABRICATING METHOD THEREOF Public/Granted day:2010-12-23
Information query
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