Invention Grant
- Patent Title: Thermal management
- Patent Title (中): 热管理
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Application No.: US13011889Application Date: 2011-01-22
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Publication No.: US08717124B2Publication Date: 2014-05-06
- Inventor: Kenneth Vanhille , David Sherrer
- Applicant: Kenneth Vanhille , David Sherrer
- Applicant Address: US VA Radford
- Assignee: Nuvotronics, LLC
- Current Assignee: Nuvotronics, LLC
- Current Assignee Address: US VA Radford
- Agency: Dann Dorfman Herrell & Skillman, PC
- Agent Niels Haun
- Main IPC: H01P3/06
- IPC: H01P3/06 ; H01P1/00

Abstract:
A transmission line structure, a transmission line thermal manager and/or process thereof. A transmission line thermal manager may include a thermal member. A thermal member may be configured to form a thermal path, for example away from one or more inner conductors of a transmission line. A part of a thermal member may be formed of an electrically insulative and thermally conductive material. One or more inner conductors may be spaced apart from one or more outer conductors in a transmission line. A transmission line and/or a transmission line thermal manager may be configured to maximize a signal through a system, for example by modifying the geometry of one or more transmission line conductors and/or of a thermal manager.
Public/Granted literature
- US20110181377A1 THERMAL MANAGEMENT Public/Granted day:2011-07-28
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