Abstract:
Disclosed and claimed herein is a hollow core coaxial cable, having a dielectric capillary with an inside wall and an outside wall, an inner conductive layer on the inside wall of the hollow core coaxial cable and an outer conductive layer on the outside wall of the hollow core coaxial cable, the conductive layers may be patterned. Further disclosed is a method of making the hollow core coaxial cable. Further disclosed are holey fiber coaxial cables, having a holey fiber capillary having an inside wall and an outside wall, an inner conductive layer on the inside wall of the hollow core coaxial cable and an outer conductive layer on the outside wall of the hollow core coaxial cable, the conductive layers may be patterned.
Abstract:
Provided are coaxial waveguide microstructures. The microstructures include a substrate and a coaxial waveguide disposed above the substrate. The coaxial waveguide includes: a center conductor; an outer conductor including one or more walls, spaced apart from and disposed around the center conductor; one or more dielectric support members for supporting the center conductor in contact with the center conductor and enclosed within the outer conductor; and a core volume between the center conductor and the outer conductor, wherein the core volume is under vacuum or in a gas state. Also provided are methods of forming coaxial waveguide microstructures by a sequential build process and hermetic packages which include a coaxial waveguide microstructure.
Abstract:
An optical device package includes a substrate having an upper surface, a distal end, a proximal end, and distal and proximal longitudinally extending notches co-linearly aligned with each other. A structure is mounted to the substrate and has at least one recessed portion. The structure can be a lid or a frame to which a lid is bonded. An optical fiber is positioned within at least one of the proximal longitudinally extending notch and the distal longitudinally extending notch and within the recessed portion of the structure mounted to the substrate. The optical device package can also include conductive legs extending upwardly from bonding pads on the upper surface of the substrate to facilitate flip mounting of the optical device package onto a circuit board or other such platform.
Abstract:
Provided are coaxial waveguide microstructures. The microstructures include a substrate and a coaxial waveguide disposed above the substrate. The coaxial waveguide includes: a center conductor; an outer conductor including one or more walls, spaced apart from and disposed around the center conductor; one or more dielectric support members for supporting the center conductor in contact with the center conductor and enclosed within the outer conductor; and a core volume between the center conductor and the outer conductor, wherein the core volume is under vacuum or in a gas state. Also provided are methods of forming coaxial waveguide microstructures by a sequential build process and hermetic packages which include a coaxial waveguide microstructure.
Abstract:
Provided are optoelectronic components which include an optoelectronic device and a structure for self-aligning the optoelectronic device. Also provided are optoelectronic modules and methods of forming optoelectronic components.
Abstract:
Provided are optoelectronic components which include an optoelectronic device and a structure for self-aligning the optoelectronic device. Also provided are optoelectronic modules and methods of forming optoelectronic components.
Abstract:
An optical device is disclosed which includes a single-mode waveguide (700) which supports a first optical mode in a first region and a second optical mode in a second region. The waveguide includes a guiding layer (703) having at least one wing (750) extended outwardly from the guiding layer (703). The guiding layer (703) may desirably have a rib waveguide (706, 707) cross sectional shape at the wings. The wings (750) decrease in width along the length of the guiding layer to convert a rib waveguide mode at the wings to a channel waveguide mode.
Abstract:
Smooth, preferably variable-sweep fluid collection device surfaces disposed into opposition with wind, river, surf, ocean or tidal currents generate enhanced velocity fluid flows at length driven into onboard work-extracting disc turbines at advantageous angles of attack. Keyed to shafts turning freely through optionally extendable volutes, disc turbines comprising a dense population of smooth, axially fixed or adjustably spaced discs conducting preferably laminar flow between adjacent elements develop significant torque through boundary layer adhesion and viscous shear-stress between fluid layers. Exhaust of disc turbine throughput into divergent channels drafting into external currents of initially higher than ambient velocity and lower pressure may reduce turbine discharge backpressure, rapidly clear system throughput, and allow normally disadvantageous drag to be utilized to develop greater work generation. Gainfully turning with, instead of at odds to natural or anthropogenic currents provided, disc turbines utilized as disclosed may provide unprecedented renewable energy from fluids in motion.
Abstract:
A system is provided for three dimensional coaxial transmission of signals in a micro-machined component, the system having, a micro-machined component matrix with a first metallic sheet having a plurality of first access holes disposed therein; a second metallic sheet having a plurality of second access holes disposed therein; a plurality of metal posts disposed between the first and second metallic sheets such that the metallic sheets are maintained at a desired distance; walls defining a coaxial transmission channel; and a coaxial transmission core disposed within the channel.
Abstract:
A process to form devices may include forming a seed layer on and/or over a substrate, modifying a seed layer selectively, forming an image-wise mold layer on and/or over a substrate and/or electrodepositing a first material on and/or over an exposed conductive area. A process may include selectively applying a temporary patterned passivation layer on a conductive substrate, selectively forming an image-wise mold layer on and/or over a substrate, forming a first material on and/or over at least one of the exposed conductive areas and/or removing a temporary patterned passivation layer. A process may include forming a sacrificial image-wise mold layer on a substrate layer, selectively placing one or more first materials in one or more exposed portions of a substrate layer, forming one or more second materials on and/or over a substrate layer and/or removing a portion of a sacrificial image-wise mold layer.