Invention Grant
- Patent Title: Method for manufacturing multi-gate transistor device
- Patent Title (中): 多栅极晶体管器件制造方法
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Application No.: US13275337Application Date: 2011-10-18
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Publication No.: US08722501B2Publication Date: 2014-05-13
- Inventor: Shih-Hung Tsai , Chien-Liang Lin , Chien-Ting Lin , Ssu-I Fu , Ying-Tsung Chen
- Applicant: Shih-Hung Tsai , Chien-Liang Lin , Chien-Ting Lin , Ssu-I Fu , Ying-Tsung Chen
- Applicant Address: TW Science-Based Industrial Park, Hsin-Chu
- Assignee: United Microelectronics Corp.
- Current Assignee: United Microelectronics Corp.
- Current Assignee Address: TW Science-Based Industrial Park, Hsin-Chu
- Agent Winston Hsu; Scott Margo
- Main IPC: H01L21/336
- IPC: H01L21/336

Abstract:
A method for manufacturing multi-gate transistor device includes providing a semiconductor substrate having a patterned semiconductor layer, a gate dielectric layer and a gate layer sequentially formed thereon, forming a multiple insulating layer sequentially having a first insulating layer and a second insulating layer and covering the patterned semiconductor layer and the gate layer, removing a portion of the multiple insulating layer to simultaneously form a first spacer around the gate layer and a second spacer around the patterned semiconductor layer, removing the second spacer to expose a portion of the first insulating layer covering the patterned semiconductor layer and simultaneously removing a portion of the first spacer to form a third spacer around the gate layer, and removing the exposed first insulating layer to expose the patterned semiconductor layer.
Public/Granted literature
- US20130095616A1 METHOD FOR MANUFACTURING MULTI-GATE TRANSISTOR DEVICE Public/Granted day:2013-04-18
Information query
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