Invention Grant
US08728910B2 Expandable film, dicing film, and method of producing semiconductor device
有权
可扩展膜,切割膜以及半导体器件的制造方法
- Patent Title: Expandable film, dicing film, and method of producing semiconductor device
- Patent Title (中): 可扩展膜,切割膜以及半导体器件的制造方法
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Application No.: US13576786Application Date: 2011-09-28
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Publication No.: US08728910B2Publication Date: 2014-05-20
- Inventor: Eiji Hayashishita , Katsutoshi Ozaki , Mitsuru Sakai , Setsuko Oike
- Applicant: Eiji Hayashishita , Katsutoshi Ozaki , Mitsuru Sakai , Setsuko Oike
- Applicant Address: JP Minato-Ku, Tokyo
- Assignee: Mitsui Chemicals, Inc.
- Current Assignee: Mitsui Chemicals, Inc.
- Current Assignee Address: JP Minato-Ku, Tokyo
- Agency: Buchanan Ingersoll & Rooney PC
- Priority: JP2010-222046 20100930; JP2011-082113 20110401
- International Application: PCT/JP2011/005466 WO 20110928
- International Announcement: WO2012/042869 WO 20120405
- Main IPC: H01L21/30
- IPC: H01L21/30 ; H01L21/46

Abstract:
To provide an olefinic expandable substrate and a dicing film that exhibits less contamination characteristics, high expandability without necking, which cannot be achieved by conventional olefinic expandable substrates. In order to achieve the object, an expandable film comprises a 1-butene-α-olefin copolymer (A) having a tensile modulus at 23° C. of 100 to 500 MPa and a propylenic elastomer composition (B) comprising a propylene-α-olefin copolymer (b1) and having a tensile modulus at 23° C. of 10 to 50 MPa, wherein the amount of the component (B) is 30 to 70 weight parts relative to 100 weight parts in total of components (A) and (B).
Public/Granted literature
- US20120309170A1 EXPANDABLE FILM, DICING FILM, AND METHOD OF PRODUCING SEMICONDUCTOR DEVICE Public/Granted day:2012-12-06
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