Invention Grant
- Patent Title: Light-receiving element, light-receiving element array, method for manufacturing light-receiving element and method for manufacturing light-receiving element array
- Patent Title (中): 光接收元件,光接收元件阵列,光接收元件的制造方法和光接收元件阵列的制造方法
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Application No.: US13451031Application Date: 2012-04-19
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Publication No.: US08729527B2Publication Date: 2014-05-20
- Inventor: Yasuhiro Iguchi , Kohei Miura , Hiroshi Inada , Youichi Nagai
- Applicant: Yasuhiro Iguchi , Kohei Miura , Hiroshi Inada , Youichi Nagai
- Applicant Address: JP Osaka
- Assignee: Sumitomo Electric Industries, Ltd.
- Current Assignee: Sumitomo Electric Industries, Ltd.
- Current Assignee Address: JP Osaka
- Agency: Fish & Richardson P.C.
- Priority: JP2008-334907 20081226
- Main IPC: H01L31/00
- IPC: H01L31/00 ; H01L21/00

Abstract:
A light-receiving element includes a group III-V compound semiconductor stacked structure that includes an absorption layer having a pn-junction therein. The stacked structure is formed on a group III-V compound semiconductor substrate. The absorption layer has a multiquantum well structure composed of group III-V compound semiconductors, and the pn-junction is formed by selectively diffusing an impurity element into the absorption layer. A diffusion concentration distribution control layer composed of a III-V group semiconductor is disposed in contact with the absorption layer on a side of the absorption layer opposite the side adjacent to the group III-V compound semiconductor substrate. The bandgap energy of the diffusion concentration distribution control layer is smaller than that of the group III-V compound semiconductor substrate. The concentration of the impurity element selectively diffused in the diffusion concentration distribution control layer is 5×1016/cm3 or less toward the absorption layer.
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