Invention Grant
- Patent Title: Printed circuit board with fins
- Patent Title (中): 带散热片的印刷电路板
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Application No.: US13049906Application Date: 2011-03-17
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Publication No.: US08735728B2Publication Date: 2014-05-27
- Inventor: Chien-Pang Cheng
- Applicant: Chien-Pang Cheng
- Applicant Address: TW Tayuan, Taoyuan
- Assignee: Zhen Ding Technology Co., Ltd.
- Current Assignee: Zhen Ding Technology Co., Ltd.
- Current Assignee Address: TW Tayuan, Taoyuan
- Agency: Novak Druce Connolly Bove + Quigg LLP
- Priority: CN201010148568 20100416
- Main IPC: H05K1/00
- IPC: H05K1/00

Abstract:
A printed circuit board includes an insulating layer, a signal trace, a ground trace, and a fin. The insulating layer has a first surface and an opposite second surface. The signal trace and the ground trace are formed on the first surface of the insulating layer. The first fin is directly formed on the ground trace. Also provided is a method for manufacturing the printed circuit board.
Public/Granted literature
- US20110253423A1 PRINTED CIRCUIT BOARD WITH FINS AND METHOD FOR MANUFACTURING SAME Public/Granted day:2011-10-20
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