Invention Grant
- Patent Title: Process and system for distributing particles for incorporation within a composite structure
- Patent Title (中): 用于分散颗粒以用于复合结构的方法和系统
-
Application No.: US12258214Application Date: 2008-10-24
-
Publication No.: US08741387B2Publication Date: 2014-06-03
- Inventor: John H. Vontell , John Putnam
- Applicant: John H. Vontell , John Putnam
- Applicant Address: US CT Hartford
- Assignee: United Technologies Corporation
- Current Assignee: United Technologies Corporation
- Current Assignee Address: US CT Hartford
- Agency: Kinney & Lange, P.A.
- Main IPC: B05D1/12
- IPC: B05D1/12 ; B05D1/34 ; B05D7/00 ; B05D3/00

Abstract:
A system and process is disclosed for binding particles to a carrier material in an isolated relationship for use in composite fabrication. A slurry comprising particles dispersed in fluid is created in particle suspension tanks, deposited as a uniform layer and filtered using reduced pressure applied to a filter belt to leave behind isolated particles, the reduced pressure further acting to overcome electrostatic and other forces of attraction between the particles until they can be permanently bound to the carrier with a binder or adhesive and collected on a take-up roll.
Public/Granted literature
- US20100104741A1 PROCESS AND SYSTEM FOR DISTRIBUTING PARTICLES FOR INCORPORATION WITHIN A COMPOSITE STRUCTURE Public/Granted day:2010-04-29
Information query