Invention Grant
- Patent Title: Spectral module and method for manufacturing spectral module
- Patent Title (中): 光谱模块和制造光谱模块的方法
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Application No.: US13964472Application Date: 2013-08-12
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Publication No.: US08742320B2Publication Date: 2014-06-03
- Inventor: Katsumi Shibayama , Takashi Kasahara , Anna Yoshida
- Applicant: Hamamatsu Photonics K.K.
- Applicant Address: JP Hamamatsu-shi, Shizuoka
- Assignee: Hamamatsu Photonics K.K.
- Current Assignee: Hamamatsu Photonics K.K.
- Current Assignee Address: JP Hamamatsu-shi, Shizuoka
- Agency: Drinker Biddle & Reath LLP
- Priority: JP2008-128687 20080515; JP2008-311087 20081205
- Main IPC: G01J3/50
- IPC: G01J3/50 ; G01J3/12

Abstract:
The present invention provides a highly reliable spectral module. When light L1 proceeding to a spectroscopic unit (4) passes through a light transmitting hole (50) in the spectral module (1) in accordance with the present invention, only the light having passed through a light entrance side unit (51) formed such as to become narrower toward a substrate (2) and entered a light exit side unit (52) formed such as to oppose a bottom face (51b) of the light entrance side unit (51) is emitted from a light exit opening (52a). Therefore, stray light M incident on a side face (51c) or bottom face (51b) of the light entrance side unit (51) is reflected to the side opposite to the light exit side unit (52) and thus is inhibited from entering the light exit side unit (52). Therefore, the reliability of the spectral module (1) can be improved.
Public/Granted literature
- US20130329225A1 SPECTRAL MODULE AND METHOD FOR MANUFACTURING SPECTRAL MODULE Public/Granted day:2013-12-12
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