Invention Grant
- Patent Title: Substrate treating system
- Patent Title (中): 底物处理系统
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Application No.: US12191603Application Date: 2008-08-14
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Publication No.: US08746171B2Publication Date: 2014-06-10
- Inventor: Joichi Nishimura
- Applicant: Joichi Nishimura
- Applicant Address: JP
- Assignee: Dainippon Screen Mfg. Co., Ltd.
- Current Assignee: Dainippon Screen Mfg. Co., Ltd.
- Current Assignee Address: JP
- Agency: Ostrolenk Faber LLP
- Priority: JP2007-211273 20070814
- Main IPC: B05C11/10
- IPC: B05C11/10 ; B05C13/02 ; G03D5/00

Abstract:
A substrate treating system includes a coating apparatus having a resist coating unit, an exposing apparatus having an exposing machine and a heat-treating unit, and a controller for controlling the resist coating unit, exposing machine and heat-treating unit. The controller coordinates schedules of treatment in the coating apparatus and exposing apparatus, such that the coating apparatus can operate efficiently despite an increase in the processing time of the exposing machine.
Public/Granted literature
- US20090044747A1 SUBSTRATE TREATING SYSTEM Public/Granted day:2009-02-19
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