Invention Grant
- Patent Title: Multilayer circuit board structure and circuitry thereof
- Patent Title (中): 多层电路板结构及其电路
-
Application No.: US13224501Application Date: 2011-09-02
-
Publication No.: US08749322B2Publication Date: 2014-06-10
- Inventor: Tzong-Lin Wu , Chuen-De Wang
- Applicant: Tzong-Lin Wu , Chuen-De Wang
- Applicant Address: TW Taipei
- Assignee: National Taiwan University
- Current Assignee: National Taiwan University
- Current Assignee Address: TW Taipei
- Agency: Rosenberg, Klein & Lee
- Main IPC: H01P3/08
- IPC: H01P3/08

Abstract:
An exemplary embodiment of the present disclosure illustrates a multilayer circuit board structure, for suppressing the undesired electromagnetic wave propagation within a specific frequency band. The multilayer circuit board structure includes a plurality of crystals and a plurality of conducting channels, wherein a crystal includes a first through fourth conducting planes, at least a first conducting connector, and at least a second conducting connector, wherein the first through the fourth conducting planes are substantially parallel to each other. The first conducting plane is electrically connected to the third conducting plane through the first conducting connector. The fourth conducting plane is electrically connected to the second conducting plane through the second conducting connector. The first and the third conducting planes are configured to be electrically separated from the second and the fourth conducting planes. Furthermore, the conducting channels are for electrically connecting between crystals in the multilayer circuit board structure.
Public/Granted literature
- US20130057362A1 MULTILAYER CIRCUIT BOARD STRUCTURE AND CIRCUITRY THEREOF Public/Granted day:2013-03-07
Information query