BALUNS WITH IMAGINARY COMMOND-MODE IMPEDANCE
    1.
    发明申请
    BALUNS WITH IMAGINARY COMMOND-MODE IMPEDANCE 审中-公开
    具有图像通用模式阻抗的BALUNS

    公开(公告)号:US20130069736A1

    公开(公告)日:2013-03-21

    申请号:US13451818

    申请日:2012-04-20

    CPC classification number: H01P5/10

    Abstract: Baluns with imaginary common-mode impedance are disclosed. A disclosed balun comprises an unbalanced port with an unbalanced terminal and a ground terminal, a balanced port with two balanced terminals opposite to each other in phase, and a transmission cell. The transmission cell has a differential transmission line, a virtually-ground patch, a ground conductor, and a conductive structure. The differential transmission line has a pair of conductive traces spaced apart from each other, and is electrically connected between the unbalanced port and the balanced port to transmit a differential signal. The virtually-ground patch is spaced apart from the differential transmission line. The conductive structure electrically connects the virtually-ground patch to the ground conductor.

    Abstract translation: 公开了具有假共模阻抗的平衡/不平衡变换器。 公开的平衡 - 不平衡变换器包括具有不平衡端子和接地端子的不平衡端口,具有彼此相位相对的两个平衡端子的平衡端口和传输单元。 传输单元具有差分传输线,虚拟接地片,接地导体和导电结构。 差动传输线具有彼此间隔开的一对导电迹线,并且电连接在不平衡端口和平衡端口之间以传输差分信号。 虚拟地面贴片与差动传输线间隔开。 导电结构将虚拟地面贴片电连接到接地导体。

    NOISE FILTERING CIRCUIT FOR SUPPRESSING EMI
    2.
    发明申请
    NOISE FILTERING CIRCUIT FOR SUPPRESSING EMI 有权
    用于抑制EMI的噪声滤波电路

    公开(公告)号:US20120262251A1

    公开(公告)日:2012-10-18

    申请号:US13443135

    申请日:2012-04-10

    Abstract: A noise filtering circuit for suppressing electromagnetic interference (EMI) is provided. The noise filtering circuit filters out high multiplied-frequency noise of a digital signal being transmitted and includes a reference voltage structure formed from conductors, a signal transmitting structure formed from a transmission conductor, a ground layer, and a ground structure electrically connected to the reference voltage structure and the ground layer. The ground structure is configured to form an inductor-capacitor oscillating structure in coordination with the electric-magnetical coupling between the reference voltage structure and the signal transmitting structure as well as the inductance of the ground structure, so that a digital signal is filtered out at a specific frequency and the passband of the digital signal can be transmitted.

    Abstract translation: 提供了用于抑制电磁干扰(EMI)的噪声滤波电路。 噪声滤波电路滤除正在发送的数字信号的高倍频噪声,并且包括由导体形成的参考电压结构,由传输导体形成的信号传输结构,接地层和与参考电连接的接地结构 电压结构和接地层。 地面结构被配置为与参考电压结构和信号传输结构之间的电磁耦合以及接地结构的电感协调地形成电感器 - 电容器振荡结构,使得数字信号在 可以发送特定频率和数字信号的通带。

    Apparatus for silencing electromagnetic noise
    3.
    发明授权
    Apparatus for silencing electromagnetic noise 有权
    用于消除电磁噪声的装置

    公开(公告)号:US08125290B2

    公开(公告)日:2012-02-28

    申请号:US12353312

    申请日:2009-01-14

    Abstract: Proposed is an apparatus for silencing electromagnetic noise, characterized by a plurality of centrally symmetrical ring-shaped through-via-hole crystalline units provided between a high voltage plane and a low voltage plane at a regular interval, thereby forming an omnidirectional noise suppression frequency band for reducing noise interference and electromagnetic radiation. In a first embodiment of the ring-shaped through-via-hole crystalline units, the through via holes are perpendicularly coupled between a metal plane and the low voltage plane. In a second embodiment of the ring-shaped through-via-hole crystalline units, the through via holes are perpendicularly coupled between two metal planes. Positioned at a regular interval, the through via holes enable provision of omnidirectional noise suppression frequency band, simplified design of a power plane, and reduction of production costs.

    Abstract translation: 提出了一种用于消除电磁噪声的装置,其特征在于以规则的间隔设置在高压面和低压面之间的多个中心对称的环形通孔结晶单元,从而形成全向噪声抑制频带 用于减少噪音干扰和电磁辐射。 在环形通孔结晶单元的第一实施例中,通孔垂直地耦合在金属平面和低压平面之间。 在环形通孔结晶单元的第二实施例中,贯通通孔垂直耦合在两个金属平面之间。 通过定时间隔定位,通孔可提供全向噪声抑制频带,简化电力平面设计,降低生产成本。

    Substrate for high-speed circuit
    4.
    发明申请
    Substrate for high-speed circuit 审中-公开
    基板用于高速电路

    公开(公告)号:US20080053689A1

    公开(公告)日:2008-03-06

    申请号:US11594864

    申请日:2006-11-09

    CPC classification number: H05K1/0231 H05K1/162 H05K2201/0187 H05K2201/09309

    Abstract: A substrate for circuits is provided in this invention. The substrate includes a first voltage reference plane, a second voltage reference plane, a first dielectric layer, and a plurality of second dielectric materials embedded in the first dielectric layer. The first dielectric layer is between the first and second voltage reference planes. Each of the plurality of second dielectric materials includes a first end contacted with the first voltage reference plane and a second end contacted with the second voltage reference plane. The dielectric constant of the first dielectric layer is different from the dielectric constant of the second dielectric materials.

    Abstract translation: 本发明提供电路用基板。 衬底包括第一电压参考平面,第二电压参考平面,第一电介质层和嵌入在第一介电层中的多个第二电介质材料。 第一介电层位于第一和第二电压参考平面之间。 多个第二电介质材料中的每一个包括与第一电压参考平面接触的第一端和与第二电压参考平面接触的第二端。 第一电介质层的介电常数不同于第二电介质材料的介电常数。

    Power plane system of high-speed digital circuit for suppressing ground bounce noise
    5.
    发明授权
    Power plane system of high-speed digital circuit for suppressing ground bounce noise 有权
    用于抑制地面反弹噪声的高速数字电路功率平面系统

    公开(公告)号:US07148425B2

    公开(公告)日:2006-12-12

    申请号:US11043605

    申请日:2005-01-26

    Abstract: The invention relates to a power plane system for suppressing ground bounce noise. The power plane system of the invention comprises a substrate, a power layer and a ground layer. The power layer comprises a plurality of metal units. There is a distance between two adjacent metal units. A plurality of bridges is used for connecting the metal units. The ground layer has a grounding metal plate. According to the invention, when the ground bounce noise occurs, the metal units can broaden the stop-band bandwidth. Therefore, the signals in the stop-band hardly are transmitted so as to suppress the ground bounce noise, and the high frequency ground bounce noise and the electromagnetic radiation can be suppressed efficiently.

    Abstract translation: 本发明涉及一种用于抑制地面反弹噪声的电力平面系统。 本发明的功率平面系统包括基板,功率层和接地层。 功率层包括多个金属单元。 两个相邻的金属单元之间有一段距离。 多个桥用于连接金属单元。 接地层有接地金属板。 根据本发明,当发生地面反弹噪声时,金属单元可以扩大阻带带宽。 因此,阻带中的信号几乎不发射,以抑制地面反弹噪声,并且可以有效地抑制高频地面反弹噪声和电磁辐射。

    Broadband ultra-flattened dispersion micro-structured fiber
    6.
    发明申请
    Broadband ultra-flattened dispersion micro-structured fiber 失效
    宽带超扁平分散微结构光纤

    公开(公告)号:US20060002674A1

    公开(公告)日:2006-01-05

    申请号:US11151113

    申请日:2005-06-13

    CPC classification number: G02B6/02233 G02B6/02357 G02B6/02361

    Abstract: The invention relates to a micro-structured fiber comprising a core region and a cladding region. The cladding region has a plurality of air holes regularly arranged on a plurality of rings, wherein the innermost ring of the fiber defines the core region. The cladding region comprises an inner circumference portion and an outer circumference portion; the inner circumference portion comprises at least one ring, the outer circumference portion comprises at least one ring, wherein the diameter of the air hole on the outer circumference portion is larger than that of the air hole on the inner circumference portion. As a result, the micro-structured fiber of the present invention has the advantages of broader band of nearly zero dispersion, less confinement loss, being easier to design due to less geometrical parameters needed to be optimized, and being easier to fabricate.

    Abstract translation: 本发明涉及一种包含芯区和包层区的微结构纤维。 包层区域具有规则地布置在多个环上的多个气孔,其中纤维的最内环限定纤芯区域。 包层区域包括内周部分和外周部分; 所述内周部包括至少一个环,所述外周部包括至少一个环,其中所述外周部上的所述气孔的直径大于所述内周部上的所述气孔的直径。 结果,本发明的微结构化纤维具有几乎零色散宽带,更少的限制损失,由于需要优化的较少几何参数而易于设计并且易于制造的优点。

    Common-mode noise suppression filter
    7.
    发明授权
    Common-mode noise suppression filter 有权
    共模噪声抑制滤波器

    公开(公告)号:US08878630B2

    公开(公告)日:2014-11-04

    申请号:US13243896

    申请日:2011-09-23

    CPC classification number: H04B3/14 H03H7/427

    Abstract: This invention provides a digital electronic device comprising: a grounded metal portion comprising a first metal plate electrically connected to ground and a first substrate disposed on the first metal plate; at least one layer of differential-mode reference metal portion comprising a second substrate and a second metal plate electrically connected to the first metal plate by at least one conductive structure; a pair of differential signal lines at least partially disposed on the second substrate of the at least one layer of differential-mode reference metal portion and electromagnetically coupled to the second metal plate of the at least one layer of differential-mode reference metal portion; and an equalizer electrically connected to the pair of differential signal lines.

    Abstract translation: 本发明提供一种数字电子设备,包括:接地金属部分,包括电连接到地的第一金属板和设置在第一金属板上的第一基板; 至少一层差模参考金属部分,包括通过至少一个导电结构与第一金属板电连接的第二基板和第二金属板; 至少部分地布置在所述至少一个所述差模参考金属部分层的所述第二基板上并与所述至少一个所述差模参考金属部分的所述第二层的所述第二金属板电磁耦合的一对差分信号线; 以及电连接到所述一对差分信号线的均衡器。

    MULTILAYER CIRCUIT BOARD STRUCTURE AND CIRCUITRY THEREOF
    8.
    发明申请
    MULTILAYER CIRCUIT BOARD STRUCTURE AND CIRCUITRY THEREOF 有权
    多层电路板结构与电路

    公开(公告)号:US20130057362A1

    公开(公告)日:2013-03-07

    申请号:US13224501

    申请日:2011-09-02

    CPC classification number: H01P1/2005 H05K1/0236

    Abstract: An exemplary embodiment of the present disclosure illustrates a multilayer circuit board structure, for suppressing the undesired electromagnetic wave propagation within a specific frequency band. The multilayer circuit board structure includes a plurality of crystals and a plurality of conducting channels, wherein a crystal includes a first through fourth conducting planes, at least a first conducting connector, and at least a second conducting connector, wherein the first through the fourth conducting planes are substantially parallel to each other. The first conducting plane is electrically connected to the third conducting plane through the first conducting connector. The fourth conducting plane is electrically connected to the second conducting plane through the second conducting connector. The first and the third conducting planes are configured to be electrically separated from the second and the fourth conducting planes. Furthermore, the conducting channels are for electrically connecting between crystals in the multilayer circuit board structure.

    Abstract translation: 本公开的示例性实施例示出了用于抑制特定频带内的不期望的电磁波传播的多层电路板结构。 多层电路板结构包括多个晶体和多个导电沟道,其中晶体包括第一至第四导电平面,至少第一导电连接器和至少第二导电连接器,其中第一至第四导电 平面基本上彼此平行。 第一导电平面通过第一导电连接器与第三导电平面电连接。 第四导电平面通过第二导电连接器与第二导电平面电连接。 第一和第三导电平面配置成与第二和第四导电平面电分离。 此外,导电通道用于电连接多层电路板结构中的晶体。

    ELECTROMAGNETIC NOISE SUPPRESSION CIRCUIT
    9.
    发明申请
    ELECTROMAGNETIC NOISE SUPPRESSION CIRCUIT 有权
    电磁噪声抑制电路

    公开(公告)号:US20120194290A1

    公开(公告)日:2012-08-02

    申请号:US13015171

    申请日:2011-01-27

    CPC classification number: H01P3/081 H01P1/2039 H01P3/026

    Abstract: An electromagnetic noise suppression circuit is provided. The suppression circuit comprises a first substrate, a first grounding plane and at least one transmission line. The transmission line is configured on a top surface of the first substrate and the first grounding plane is configured on the bottom surface of the first substrate. The first grounding plane comprises a first distributed coupling structure. The first distributed coupling structure and the transmission line can be equivalent to an inductor-capacitor resonant circuit. The electromagnetic noise within a designated frequency band can be suppressed by the distributed coupling structure of the electromagnetic noise suppression circuit to avoid interfering the signal transmitted by the transmission line and the electromagnetic radiation induced by the electromagnetic noise.

    Abstract translation: 提供电磁噪声抑制电路。 抑制电路包括第一基板,第一接地平面和至少一个传输线。 所述传输线被配置在所述第一基板的顶表面上,并且所述第一接地平面配置在所述第一基板的底表面上。 第一接地平面包括第一分布耦合结构。 第一分布耦合结构和传输线可以等效于电感 - 电容谐振电路。 可以通过电磁噪声抑制电路的分布耦合结构来抑制指定频带内的电磁噪声,以避免干扰由传输线传输的信号和由电磁噪声引起的电磁辐射。

    DEFECTED GROUND STRUCTURE WITH SHIELDING EFFECT
    10.
    发明申请
    DEFECTED GROUND STRUCTURE WITH SHIELDING EFFECT 有权
    具有屏蔽效应的缺陷接地结构

    公开(公告)号:US20120057323A1

    公开(公告)日:2012-03-08

    申请号:US12902155

    申请日:2010-10-12

    Abstract: A defected ground structure with shielding effect is provided. The structure includes a dielectric layer, a defected metal layer, a grounded metal layer and at least a conductive mushroom-like structure. The defected metal layer has a line-shaped opening and is disposed in the dielectric layer. The conductive mushroom-like structure is disposed between the defected metal layer and the grounded metal layer and is arranged along an extending direction of the line-shaped opening periodically. The conductive mushroom-like structure includes a fungating part and a stipe part. The fungating part is parallel to the defected metal layer and a distance is maintained away from the defected metal layer. The projection area of the fungating part on the defected metal layer covers a length of the line-shaped opening corresponding to the fungating part. The stipe part connects the fungating part and the grounded metal layer.

    Abstract translation: 提供了具有屏蔽效果的缺陷接地结构。 该结构包括电介质层,缺陷金属层,接地金属层和至少导电蘑菇状结构。 缺陷金属层具有线状开口并设置在电介质层中。 导电蘑菇状结构设置在缺陷金属层和接地金属层之间,并且沿着线状开口的延伸方向周期性地设置。 导电蘑菇状结构包括真菌部分和茎部分。 真菌部分平行于缺陷的金属层,远离缺陷的金属层。 在缺陷金属层上的真菌部分的投影面积覆盖对应于真菌部分的线状开口的长度。 管脚部分连接真菌部分和接地的金属层。

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