Abstract:
Baluns with imaginary common-mode impedance are disclosed. A disclosed balun comprises an unbalanced port with an unbalanced terminal and a ground terminal, a balanced port with two balanced terminals opposite to each other in phase, and a transmission cell. The transmission cell has a differential transmission line, a virtually-ground patch, a ground conductor, and a conductive structure. The differential transmission line has a pair of conductive traces spaced apart from each other, and is electrically connected between the unbalanced port and the balanced port to transmit a differential signal. The virtually-ground patch is spaced apart from the differential transmission line. The conductive structure electrically connects the virtually-ground patch to the ground conductor.
Abstract:
A noise filtering circuit for suppressing electromagnetic interference (EMI) is provided. The noise filtering circuit filters out high multiplied-frequency noise of a digital signal being transmitted and includes a reference voltage structure formed from conductors, a signal transmitting structure formed from a transmission conductor, a ground layer, and a ground structure electrically connected to the reference voltage structure and the ground layer. The ground structure is configured to form an inductor-capacitor oscillating structure in coordination with the electric-magnetical coupling between the reference voltage structure and the signal transmitting structure as well as the inductance of the ground structure, so that a digital signal is filtered out at a specific frequency and the passband of the digital signal can be transmitted.
Abstract:
Proposed is an apparatus for silencing electromagnetic noise, characterized by a plurality of centrally symmetrical ring-shaped through-via-hole crystalline units provided between a high voltage plane and a low voltage plane at a regular interval, thereby forming an omnidirectional noise suppression frequency band for reducing noise interference and electromagnetic radiation. In a first embodiment of the ring-shaped through-via-hole crystalline units, the through via holes are perpendicularly coupled between a metal plane and the low voltage plane. In a second embodiment of the ring-shaped through-via-hole crystalline units, the through via holes are perpendicularly coupled between two metal planes. Positioned at a regular interval, the through via holes enable provision of omnidirectional noise suppression frequency band, simplified design of a power plane, and reduction of production costs.
Abstract:
A substrate for circuits is provided in this invention. The substrate includes a first voltage reference plane, a second voltage reference plane, a first dielectric layer, and a plurality of second dielectric materials embedded in the first dielectric layer. The first dielectric layer is between the first and second voltage reference planes. Each of the plurality of second dielectric materials includes a first end contacted with the first voltage reference plane and a second end contacted with the second voltage reference plane. The dielectric constant of the first dielectric layer is different from the dielectric constant of the second dielectric materials.
Abstract:
The invention relates to a power plane system for suppressing ground bounce noise. The power plane system of the invention comprises a substrate, a power layer and a ground layer. The power layer comprises a plurality of metal units. There is a distance between two adjacent metal units. A plurality of bridges is used for connecting the metal units. The ground layer has a grounding metal plate. According to the invention, when the ground bounce noise occurs, the metal units can broaden the stop-band bandwidth. Therefore, the signals in the stop-band hardly are transmitted so as to suppress the ground bounce noise, and the high frequency ground bounce noise and the electromagnetic radiation can be suppressed efficiently.
Abstract:
The invention relates to a micro-structured fiber comprising a core region and a cladding region. The cladding region has a plurality of air holes regularly arranged on a plurality of rings, wherein the innermost ring of the fiber defines the core region. The cladding region comprises an inner circumference portion and an outer circumference portion; the inner circumference portion comprises at least one ring, the outer circumference portion comprises at least one ring, wherein the diameter of the air hole on the outer circumference portion is larger than that of the air hole on the inner circumference portion. As a result, the micro-structured fiber of the present invention has the advantages of broader band of nearly zero dispersion, less confinement loss, being easier to design due to less geometrical parameters needed to be optimized, and being easier to fabricate.
Abstract:
This invention provides a digital electronic device comprising: a grounded metal portion comprising a first metal plate electrically connected to ground and a first substrate disposed on the first metal plate; at least one layer of differential-mode reference metal portion comprising a second substrate and a second metal plate electrically connected to the first metal plate by at least one conductive structure; a pair of differential signal lines at least partially disposed on the second substrate of the at least one layer of differential-mode reference metal portion and electromagnetically coupled to the second metal plate of the at least one layer of differential-mode reference metal portion; and an equalizer electrically connected to the pair of differential signal lines.
Abstract:
An exemplary embodiment of the present disclosure illustrates a multilayer circuit board structure, for suppressing the undesired electromagnetic wave propagation within a specific frequency band. The multilayer circuit board structure includes a plurality of crystals and a plurality of conducting channels, wherein a crystal includes a first through fourth conducting planes, at least a first conducting connector, and at least a second conducting connector, wherein the first through the fourth conducting planes are substantially parallel to each other. The first conducting plane is electrically connected to the third conducting plane through the first conducting connector. The fourth conducting plane is electrically connected to the second conducting plane through the second conducting connector. The first and the third conducting planes are configured to be electrically separated from the second and the fourth conducting planes. Furthermore, the conducting channels are for electrically connecting between crystals in the multilayer circuit board structure.
Abstract:
An electromagnetic noise suppression circuit is provided. The suppression circuit comprises a first substrate, a first grounding plane and at least one transmission line. The transmission line is configured on a top surface of the first substrate and the first grounding plane is configured on the bottom surface of the first substrate. The first grounding plane comprises a first distributed coupling structure. The first distributed coupling structure and the transmission line can be equivalent to an inductor-capacitor resonant circuit. The electromagnetic noise within a designated frequency band can be suppressed by the distributed coupling structure of the electromagnetic noise suppression circuit to avoid interfering the signal transmitted by the transmission line and the electromagnetic radiation induced by the electromagnetic noise.
Abstract:
A defected ground structure with shielding effect is provided. The structure includes a dielectric layer, a defected metal layer, a grounded metal layer and at least a conductive mushroom-like structure. The defected metal layer has a line-shaped opening and is disposed in the dielectric layer. The conductive mushroom-like structure is disposed between the defected metal layer and the grounded metal layer and is arranged along an extending direction of the line-shaped opening periodically. The conductive mushroom-like structure includes a fungating part and a stipe part. The fungating part is parallel to the defected metal layer and a distance is maintained away from the defected metal layer. The projection area of the fungating part on the defected metal layer covers a length of the line-shaped opening corresponding to the fungating part. The stipe part connects the fungating part and the grounded metal layer.