Invention Grant
- Patent Title: Manufacturing method of array substrate
- Patent Title (中): 阵列基板的制造方法
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Application No.: US14155380Application Date: 2014-01-15
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Publication No.: US08759165B2Publication Date: 2014-06-24
- Inventor: Hui-Ling Ku , Chia-Yu Chen , Yi-Chen Chung , Yu-Hung Chen , Chi-Wei Chou , Fan-Wei Chang , Hsueh-Hsing Lu , Hung-Che Ting
- Applicant: AU Optronics Corp.
- Applicant Address: TW Science-Based Industrial Park, Hsin-Chu
- Assignee: AU Optronics Corp.
- Current Assignee: AU Optronics Corp.
- Current Assignee Address: TW Science-Based Industrial Park, Hsin-Chu
- Agent Winston Hsu; Scott Margo
- Priority: TW100148074A 20111222; TW101110547A 20120327
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L21/84

Abstract:
A manufacturing method of an array substrate includes the following steps. A first conductive layer, a gate insulating layer, a semiconductor layer, an etching stop layer, and a first patterned photoresist are successively formed on a substrate. The etching stop layer and the semiconductor layer uncovered by the first patterned photoresist are then removed by a first etching process. A patterned gate insulating layer and a patterned etching stop layer are then formed through a second etching process. The first conductive layer uncovered by the patterned gate insulating layer is then removed to form a gate electrode. The semiconductor layer uncovered by the patterned etching stop layer is then removed to form a patterned semiconductor layer and partially expose the patterned gate insulating layer.
Public/Granted literature
- US20140127844A1 MANUFACTURING METHOD OF ARRAY SUBSTRATE Public/Granted day:2014-05-08
Information query
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