Invention Grant
- Patent Title: Package and fabrication method of the same
- Patent Title (中): 包装和制造方法相同
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Application No.: US13088722Application Date: 2011-04-18
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Publication No.: US08759838B2Publication Date: 2014-06-24
- Inventor: Kazutaka Takagi
- Applicant: Kazutaka Takagi
- Applicant Address: JP Tokyo
- Assignee: Kabushiki Kaisha Toshiba
- Current Assignee: Kabushiki Kaisha Toshiba
- Current Assignee Address: JP Tokyo
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2010-176926 20100806
- Main IPC: H01L29/161
- IPC: H01L29/161 ; H01L29/20 ; H01L21/50 ; H01L23/373
Abstract:
According to one embodiment, provided are a package utilized for a high frequency semiconductor device and a fabrication method for such the package, the package including: a conductive base plate including a CTE control layer composed of compound material, and a heat conduction layer disposed on the CTE control layer and composed of Cu.
Public/Granted literature
- US20120032190A1 PACKAGE AND FABRICATION METHOD OF THE SAME Public/Granted day:2012-02-09
Information query
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