Invention Grant
- Patent Title: Apparatus and method for measuring radiation energy during thermal processing
- Patent Title (中): 热处理过程中测量辐射能的装置和方法
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Application No.: US13903387Application Date: 2013-05-28
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Publication No.: US08761587B2Publication Date: 2014-06-24
- Inventor: Joseph M. Ranish , Blake Koelmel , Aaron Muir Hunter
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Patterson & Sheridan, LLP
- Main IPC: A21B2/00
- IPC: A21B2/00

Abstract:
Embodiments of the present invention provide apparatus and method for reducing heating source radiation influence in temperature measurement during thermal processing. In one embodiment of the present invention, background radiant energy, such as an energy source of a thermal processing chamber, is marked within a selected spectrum, a characteristic of the background is then determined by measuring radiant energy at a reference wavelength within the selected spectrum and a comparing wavelength just outside the selected spectrum.
Public/Granted literature
- US20130280824A1 APPARATUS AND METHOD FOR MEASURING RADIATION ENERGY DURING THERMAL PROCESSING Public/Granted day:2013-10-24
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