Invention Grant
- Patent Title: Intervertebral implant
- Patent Title (中): 椎间植入物
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Application No.: US12969330Application Date: 2010-12-15
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Publication No.: US08764831B2Publication Date: 2014-07-01
- Inventor: Beat Lechmann , Dominique Burkard , Chris M. J. Cain , Claude Mathieu
- Applicant: Beat Lechmann , Dominique Burkard , Chris M. J. Cain , Claude Mathieu
- Applicant Address: US MA Raynham
- Assignee: DePuy Synthes Products, LLC
- Current Assignee: DePuy Synthes Products, LLC
- Current Assignee Address: US MA Raynham
- Agency: Baker & Hostetler LLP
- Main IPC: A61F2/44
- IPC: A61F2/44
Abstract:
An intervertebral implant having a three-dimensional body and a securing plate. The intervertebral implant also includes a front plate (8) displaceably disposed as an insert with a front side of the three-dimensional body.
Public/Granted literature
- US20110087327A1 INTERVERTEBRAL IMPLANT Public/Granted day:2011-04-14
Information query
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