Invention Grant
- Patent Title: Semiconductor structure and method for manufacturing the same
- Patent Title (中): 半导体结构及其制造方法
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Application No.: US13454149Application Date: 2012-04-24
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Publication No.: US08766358B2Publication Date: 2014-07-01
- Inventor: Chiu-Te Lee , Ke-Feng Lin , Shu-Wen Lin , Kun-Huang Yu , Chih-Chung Wang , Te-Yuan Wu
- Applicant: Chiu-Te Lee , Ke-Feng Lin , Shu-Wen Lin , Kun-Huang Yu , Chih-Chung Wang , Te-Yuan Wu
- Applicant Address: TW Hsinchu
- Assignee: United Microelectronics Corp.
- Current Assignee: United Microelectronics Corp.
- Current Assignee Address: TW Hsinchu
- Agency: WPAT, PC
- Agent Justin King
- Main IPC: H01L29/76
- IPC: H01L29/76

Abstract:
A semiconductor structure comprises a substrate having a first conductive type; a deep well having a second conductive type formed in the substrate and extending down from a surface of the substrate; a first well having the first conductive type and a second well having the second conductive type both formed in the deep well and extending down from the surface of the substrate, and the second well spaced apart from the first well; a gate electrode formed on the substrate and disposed between the first and second wells; an isolation extending down from the surface of the substrate and disposed between the gate electrode and the second well; a conductive plug including a first portion and a second portion electrically connected to each other, and the first portion electrically connected to the gate electrode, and the second portion penetrating into the isolation.
Public/Granted literature
- US20130277742A1 SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING THE SAME Public/Granted day:2013-10-24
Information query
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