Invention Grant
US08770823B2 Silicon-based cooling package for light-emitting devices 有权
用于发光器件的硅基冷却封装

  • Patent Title: Silicon-based cooling package for light-emitting devices
  • Patent Title (中): 用于发光器件的硅基冷却封装
  • Application No.: US13359592
    Application Date: 2012-01-27
  • Publication No.: US08770823B2
    Publication Date: 2014-07-08
  • Inventor: Gerald Ho Kim
  • Applicant: Gerald Ho Kim
  • Agent Andy M. Han
  • Main IPC: F21V33/00
  • IPC: F21V33/00
Silicon-based cooling package for light-emitting devices
Abstract:
Various embodiments of a thermal energy transfer apparatus that removes thermal energy from a light-emitting device are described. In one aspect, an apparatus comprises a silicon-based base plate and a silicon-based cover element disposed on the base plate. The base plate includes a recess to receive a light-emitting device therein. The base plate is coated with a first electrically-conductive pattern that forms a first electrode. The base plate is further coated with a second electrically-conductive pattern that is electrically isolated from the first electrically-conductive pattern. The cover element holds the light-emitting device between the base plate and the cover element with at least a portion of a light-emitting surface of the light-emitting device exposed. The cover element is coated with a third electrically-conductive pattern that is in contact with the second electrically-conductive pattern to form a second electrode when the cover element is disposed on the base plate.
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