Invention Grant
- Patent Title: Silicon-based cooling package for light-emitting devices
- Patent Title (中): 用于发光器件的硅基冷却封装
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Application No.: US13359592Application Date: 2012-01-27
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Publication No.: US08770823B2Publication Date: 2014-07-08
- Inventor: Gerald Ho Kim
- Applicant: Gerald Ho Kim
- Agent Andy M. Han
- Main IPC: F21V33/00
- IPC: F21V33/00

Abstract:
Various embodiments of a thermal energy transfer apparatus that removes thermal energy from a light-emitting device are described. In one aspect, an apparatus comprises a silicon-based base plate and a silicon-based cover element disposed on the base plate. The base plate includes a recess to receive a light-emitting device therein. The base plate is coated with a first electrically-conductive pattern that forms a first electrode. The base plate is further coated with a second electrically-conductive pattern that is electrically isolated from the first electrically-conductive pattern. The cover element holds the light-emitting device between the base plate and the cover element with at least a portion of a light-emitting surface of the light-emitting device exposed. The cover element is coated with a third electrically-conductive pattern that is in contact with the second electrically-conductive pattern to form a second electrode when the cover element is disposed on the base plate.
Public/Granted literature
- US20120195051A1 Silicon-Based Cooling Package for Light-Emitting Devices Public/Granted day:2012-08-02
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