公开(公告)号：US20210282856A1

公开(公告)日：2021-09-16

申请号：US17334795

申请日：2021-05-31

Applicant: Jay Eunjae Kim ,  Gerald Ho Kim

Inventor： Jay Eunjae Kim ,  Gerald Ho Kim

IPC: A61B18/22

Abstract: Embodiments of an apparatus and method for sealing and cutting of tissue during surgeries, especially in general, endoscopic, laparoscopic and robotic, are described. In one aspect, an apparatus comprises a laser system and a laser beam delivery unit. The laser system comprises a tissue cutting laser configured to emit a first laser beam to cut a tissue. The laser system also comprises a tissue sealing laser configured to emit a second laser beam to seal the tissue. The laser beam delivery unit is detachably coupled to the laser system and is configured to guide and direct the first and second laser beams to cut and seal the tissue.

公开(公告)号：US20210085812A1

公开(公告)日：2021-03-25

申请号：US17023294

申请日：2020-09-16

Applicant: Gerald Ho Kim

Inventor： Gerald Ho Kim

IPC: A61L2/10 ,  A61L2/24 ,  A61L2/26

Abstract: An ultraviolet C (UV-C) disinfection device includes a UV-C light-emitting diode (LED) illuminator which includes a UV-C source module and a UV-C LED coupling module. The UV-C source module includes a heat spreader and a UV LED chip that is mounted on the heat spreader which is configured to be mounted on a printed circuit board (PCB). The UV-C LED coupling module includes a holder and a rod configured to carry a UV-C light emitted from the UV-C LED chip from a first distal end of the rod to an opposite second distal end of the rod such that the UV-C light gets leaks out from a side of the rod to deliver at least a portion of the UV-C light to a surrounding of the rod, with the rod secured with the holder positioning the rod onto the UV-C chip.

公开(公告)号：US10834849B2

公开(公告)日：2020-11-10

申请号：US16691394

申请日：2019-11-21

Applicant: Gerald Ho Kim

Inventor： Gerald Ho Kim

IPC: H05K7/20 ,  H01L23/367 ,  H05K1/02 ,  H01L23/427 ,  H01L23/467 ,  H01L29/06 ,  F28F3/04 ,  H05K5/03 ,  H05K5/04 ,  H01L23/13

Abstract: Examples of a thermal management unit and an electronic apparatus utilizing the thermal management unit are described. In one aspect, the thermal management unit includes a heat sink. The heat sink includes a base portion, a first protrusion structure and a second protrusion structure. The base portion has a first side and a second side opposite the first side. The first protrusion structure protrudes from the first side of the base portion, and includes multiple fins. The second protrusion structure protrudes from the second side of the base portion, and includes multiple ribs. The heat sink may be made of silicon.

公开(公告)号：US20180019179A1

公开(公告)日：2018-01-18

申请号：US15678921

申请日：2017-08-16

Applicant: Gerald Ho Kim

Inventor： Gerald Ho Kim

IPC: H01L23/367 ,  F28F3/04 ,  H01L23/373 ,  H05K7/20 ,  H05K1/02 ,  H01L23/40

CPC classification number: H01L23/3672 ,  F28F3/048 ,  H01L23/367 ,  H01L23/3738 ,  H01L2023/4018 ,  H01L2924/0002 ,  H01S5/021 ,  H01S5/02469 ,  H05K1/0209 ,  H05K7/20409 ,  H01L2924/00

Abstract: Embodiments of a silicon-based heat dissipation device and a chip module assembly are described. An apparatus includes a chip module assembly that includes a silicon-based heat dissipation device and an extended device coupled to the silicon-based heat dissipation device. The silicon-based heat dissipation device includes a base portion having a first primary side and a second primary side opposite the first primary side. The silicon-based heat dissipation device also includes a protrusion portion on the first primary side of the base portion and protruding therefrom, with the protrusion portion having a plurality of fins. The extended device includes an extended layer. The second primary side of the base portion is configured to receive one or more heat-generating devices thereon such that at least a portion of heat generated by the one or more heat-generating devices is dissipated to the silicon-based heat-dissipation device by conduction.

公开(公告)号：US20170188481A1

公开(公告)日：2017-06-29

申请号：US15459637

申请日：2017-03-15

Applicant: Gerald Ho Kim

Inventor： Gerald Ho Kim

IPC: H05K7/20 ,  H05K5/03 ,  H05K5/04 ,  H01L23/427 ,  H05K1/02

CPC classification number: H05K7/2029 ,  F28F3/048 ,  H01L23/13 ,  H01L23/367 ,  H01L23/3675 ,  H01L23/3677 ,  H01L23/427 ,  H01L23/4275 ,  H01L23/467 ,  H01L29/0657 ,  H01L2924/0002 ,  H05K1/0204 ,  H05K1/0206 ,  H05K1/0209 ,  H05K5/03 ,  H05K5/04 ,  H05K2201/066 ,  H05K2201/09054 ,  H01L2924/00

Abstract: Examples of a thermal management unit and an electronic apparatus utilizing the thermal management unit are described. In one aspect, the thermal management unit includes a heat sink. The heat sink includes a base portion, a first protrusion structure and a second protrusion structure. The base portion has a first side and a second side opposite the first side. The first protrusion structure protrudes from the first side of the base portion, and includes multiple fins. The second protrusion structure protrudes from the second side of the base portion, and includes multiple ribs. The heat sink may be made of silicon.

公开(公告)号：US09258878B2

公开(公告)日：2016-02-09

申请号：US13928380

申请日：2013-06-27

Applicant: Gerald Ho Kim ,  Jay Eunjae Kim

Inventor： Gerald Ho Kim ,  Jay Eunjae Kim

IPC: H05K7/20 ,  H05K1/02 ,  H01L23/473

CPC classification number: H05K1/0201 ,  H05K1/0206 ,  H05K1/0207 ,  H05K2201/062 ,  H05K2201/066 ,  H05K2201/09663

Abstract: Embodiments of a mechanism of thermal isolation for multiple heat-generating devices on a substrate are described. In one aspect, a substrate is configured for a plurality of heat-generating devices to be disposed thereon. The substrate comprises an electrically-conductive layer that is electrically coupled to the heat-generating devices when the heat-generating devices are disposed on the substrate. The electrically-conductive layer is configured to thermally isolate the heat-generating devices such that there is no thermal coupling through the electrically-conductive layer amongst the heat-generating devices.

Abstract translation: 对衬底上的多个发热装置的热隔离机理的实施例进行了说明。 在一个方面，衬底被配置用于要放置在其上的多个发热装置。 衬底包括当发热器件设置在衬底上时电耦合到发热器件的导电层。 导电层被配置为热分离发热器件，使得在发热器件之间不存在通过导电层的热耦合。

公开(公告)号：US20160029517A1

公开(公告)日：2016-01-28

申请号：US14872391

申请日：2015-10-01

Applicant: Gerald Ho Kim ,  Jay Eunjae Kim

Inventor： Gerald Ho Kim ,  Jay Eunjae Kim

IPC: H05K7/20

CPC classification number: H05K7/20409 ,  F28F3/048 ,  H01L23/367 ,  H01L23/3672 ,  H01L23/3738 ,  H01L2924/0002 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/1432 ,  H01L2924/1434 ,  H01S5/021 ,  H01S5/02469 ,  H05K7/205 ,  H01L2924/00

Abstract: Embodiments of a silicon-based heat dissipation device and a chip module assembly are described. An apparatus may include a silicon-based heat dissipation device, an extended device coupled to the silicon-based heat-dissipation device and heat-generating devices mounted on the silicon-based heat dissipation device. The silicon-based heat dissipation device may include a base portion having a first primary side and a second primary side opposite the first primary side. The silicon-based heat dissipation device may also include a protrusion portion on the first primary side of the base portion and protruding therefrom. The protrusion portion may include multiple fins. The base portion may include a slit opening with a first heat-generating device of the heat-generating devices on a first side of the slit opening and a second heat-generating device of the heat-generating devices on a second side of the slit opening opposite the first side of the slit opening.

Abstract translation: 描述了硅基散热装置和芯片模块组件的实施例。 装置可以包括硅基散热装置，耦合到硅基散热装置的扩展装置和安装在硅基散热装置上的发热装置。 硅基散热装置可以包括具有第一初级侧和与第一初级侧相对的第二初级侧的基部。 硅基散热装置还可以包括在基部的第一初级侧上并从其突出的突出部分。 突出部分可以包括多个散热片。 基部可以包括狭缝开口，其具有在狭缝开口的第一侧上的发热装置的第一发热装置和在狭缝开口的第二侧上的发热装置的第二发热装置 与狭缝开口的第一侧相对。

公开(公告)号：US09159642B2

公开(公告)日：2015-10-13

申请号：US13929791

申请日：2013-06-28

Applicant: Gerald Ho Kim ,  Jay Eunjae Kim

Inventor： Gerald Ho Kim ,  Jay Eunjae Kim

IPC: H01L23/367 ,  H01L23/373 ,  F28F3/04

CPC classification number: H01L23/3738 ,  F28F3/048 ,  H01L23/367 ,  H01L23/3672 ,  H01L2924/0002 ,  H01L2924/00

Abstract: Embodiments of a silicon-based heat dissipation device and a chip module assembly utilizing the silicon-based heat dissipation device are described. In one aspect, the chip module assembly includes a chip module and a primary heat dissipation module. The chip module includes a board and at least one heat-generating device. The board includes a first primary side and a second primary side opposite the first primary side. The at least one heat-generating device is disposed on the first primary side of the board. The primary heat dissipation module includes at least one silicon-based heat dissipation device disposed on the at least one heat-generating device.

Abstract translation: 描述了硅基散热装置和利用硅基散热装置的芯片模块组件的实施例。 一方面，芯片模块组件包括芯片模块和主散热模块。 芯片模块包括板和至少一个发热装置。 板包括与第一初级侧相对的第一初级侧和第二初级侧。 至少一个发热装置设置在板的第一初级侧上。 主散热模块包括设置在至少一个发热装置上的至少一个硅基散热装置。

公开(公告)号：US09089075B2

公开(公告)日：2015-07-21

申请号：US13835105

申请日：2013-03-15

Applicant: Gerald Ho Kim ,  Jay Eunjae Kim

Inventor： Gerald Ho Kim ,  Jay Eunjae Kim

IPC: H05K7/20 ,  F28F21/06 ,  H01L23/367 ,  H01L23/373

CPC classification number: H05K7/2039 ,  F28F21/065 ,  H01L23/367 ,  H01L23/3675 ,  H01L23/3738 ,  H01L25/167 ,  H01L31/024 ,  H01L2924/0002 ,  H01S5/02248 ,  H01S5/02469 ,  H01S5/183 ,  H01L2924/00

Abstract: Various embodiments of an apparatus that simultaneously cools and thermally decouples adjacent electrically-driven devices in close proximity are provided. In one aspect, an apparatus comprises a first non-silicon heat sink and a first silicon-based heat sink disposed on the first non-silicon heat sink. The first silicon-based heat sink is configured to receive a first electrically-driven device on a first portion of the first silicon-based heat sink and to receive a second electrically-driven device on a second portion of the first silicon-based heat sink. The first silicon-based heat sink includes a first groove or a first opening between the first portion and the second portion such that a heat conduction path between the first electrically-driven device and the first non-silicon heat sink through the first silicon-based heat sink is shorter than a heat conduction path between the first electrically-driven device and the second electrically-driven device through the first silicon-based heat sink.

Abstract translation: 提供了一种同时冷却并使邻近的电驱动装置热解耦的装置的各种实施例。 一方面，一种装置包括第一非硅散热器和设置在第一非硅散热器上的第一硅基散热器。 第一硅基散热器被配置为在第一硅基散热器的第一部分上接收第一电驱动装置，并且在第一硅基散热片的第二部分上接收第二电驱动装置 。 第一硅基散热器包括在第一部分和第二部分之间的第一凹槽或第一开口，使得第一电驱动装置和第一非硅散热器之间的热传导路径穿过第一硅基散热片 散热器比通过第一硅基散热器的第一电驱动装置和第二电驱动装置之间的热传导路径短。

公开(公告)号：US09008147B2

公开(公告)日：2015-04-14

申请号：US13888153

申请日：2013-05-06

Applicant: Gerald Ho Kim ,  Jay Eunjae Kim

Inventor： Gerald Ho Kim ,  Jay Eunjae Kim

IPC: H01S3/08 ,  F21V29/00 ,  F28F21/00 ,  F21V5/04 ,  H01S5/022 ,  H01S5/40 ,  H01S5/024

CPC classification number: F21V29/70 ,  F21V5/043 ,  F28F21/00 ,  H01S5/02236 ,  H01S5/02252 ,  H01S5/02288 ,  H01S5/02469 ,  H01S5/4031

Abstract: A silicon-based thermal energy transfer apparatus that aids dissipation of thermal energy from a heat-generating device, such as an edge-emitting laser diode, is provided. In one aspect, the apparatus comprises a base portion and a support portion. The base portion is made of silicon and includes a first primary surface. The first primary surface includes at least first and second V-notch grooves thereon. The support portion is made of silicon and includes at least first and second edges that are interlockingly received in the first and second V-notch grooves when the support portion is mounted on the base portion.

Abstract translation: 提供了一种有助于散发来自诸如边缘发射激光二极管等发热装置的热能的硅基热能转移装置。 一方面，该装置包括基部和支撑部。 基部由硅制成并包括第一主表面。 第一主表面至少包括第一和第二V形凹槽。 支撑部分由硅制成并且当支撑部分安装在基部上时，至少包括第一和第二边缘，该第一边缘和第二边缘互锁地容纳在第一和第二V形凹槽中。