Invention Grant
- Patent Title: Method of reducing temperature difference between a pair of substrates and fluid reaction device using the same
- Patent Title (中): 降低一对基板与使用其的液体反应装置之间的温度差的方法
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Application No.: US12904557Application Date: 2010-10-14
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Publication No.: US08771610B2Publication Date: 2014-07-08
- Inventor: Kak Namkoong , Su-hyeon Kim , Jin-tae Kim , Chin-sung Park , Young-sun Lee
- Applicant: Kak Namkoong , Su-hyeon Kim , Jin-tae Kim , Chin-sung Park , Young-sun Lee
- Applicant Address: KR
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR
- Agency: Cantor Colburn LLP
- Priority: KR10-2006-0084819 20060904
- Main IPC: B01L3/00
- IPC: B01L3/00

Abstract:
A fluid reaction device includes a microfluidic reaction chip which accommodates a fluid, a heater, and a heat transfer facilitating layer which is interposed between the microfluidic reaction chip and the heater, the heat transfer facilitating layer has a higher thermal conductivity than air and can hold particles, wherein formation of an air layer can be prevented.
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