Invention Grant
- Patent Title: FINFET transistor structure and method for making the same
- Patent Title (中): FINFET晶体管结构及其制造方法
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Application No.: US13116018Application Date: 2011-05-26
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Publication No.: US08772860B2Publication Date: 2014-07-08
- Inventor: Rai-Min Huang , Sheng-Huei Dai , Chen-Hua Tsai , Duan Quan Liao , Yikun Chen , Xiao Zhong Zhu
- Applicant: Rai-Min Huang , Sheng-Huei Dai , Chen-Hua Tsai , Duan Quan Liao , Yikun Chen , Xiao Zhong Zhu
- Applicant Address: TW Science-Based Industrial Park, Hsin-Chu
- Assignee: United Microelectronics Corp.
- Current Assignee: United Microelectronics Corp.
- Current Assignee Address: TW Science-Based Industrial Park, Hsin-Chu
- Agent Winston Hsu; Scott Margo
- Main IPC: H01L27/108
- IPC: H01L27/108

Abstract:
A FINFET transistor structure includes a substrate, a fin structure, an insulating layer and a gate structure. The fin structure is disposed on the substrate and directly connected to the substrate. Besides, the fin structure includes a fin conductive layer and a bottle neck. The insulating layer covers the substrate and has a protruding side which is formed by partially surrounding the bottle neck of the fin structure, and a bottom side in direct contact with the substrate so that the protruding side extend to and under the fin structure. The gate structure partially surrounds the fin structure.
Public/Granted literature
- US20120299099A1 FINFET TRANSISTOR STRUCTURE AND METHOD FOR MAKING THE SAME Public/Granted day:2012-11-29
Information query
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