Invention Grant
- Patent Title: Method and apparatus for bypassing silicon bugs
- Patent Title (中): 绕过硅虫的方法和装置
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Application No.: US12817791Application Date: 2010-06-17
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Publication No.: US08791713B2Publication Date: 2014-07-29
- Inventor: William L. Walker
- Applicant: William L. Walker
- Applicant Address: US CA Sunnyvale
- Assignee: Advanced Micro Devices, Inc.
- Current Assignee: Advanced Micro Devices, Inc.
- Current Assignee Address: US CA Sunnyvale
- Main IPC: G01R31/26
- IPC: G01R31/26

Abstract:
The present invention provides a method and apparatus for bypassing silicon bugs. One exemplary embodiment of the method includes using a logic element formed on a substrate to detect a predefined trigger condition indicating onset of a functional bug during operation of a semiconductor device formed on the substrate. The method also includes modifying operation of the semiconductor device to avoid onset of the functional bug by taking a predefined action associated with the predefined trigger condition.
Public/Granted literature
- US20110309855A1 METHOD AND APPARATUS FOR BYPASSING SILICON BUGS Public/Granted day:2011-12-22
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