In an embodiment, an IC assembly comprises an IC having a top surface comprising a plurality of input/output terminations, a plurality of leads arranged around the IC, a plurality of bond wires, and an encapsulant. Each lead has a first surface and a second surface opposite the first surface, and has a feature protruding from the first surface proximate an inward end of the lead nearest the IC. The feature extends from the first surface to approximately a plane that includes a bottom surface of the IC. Each bond wire connects a respective lead to a respective I/O terminal on the IC. The encapsulant seals the bond wires, the IC, and a first portion of the leads that includes the feature. The feature creates on offset from the bottom of the IC to permit the encapsulant to surround the first portion.