Invention Grant
- Patent Title: Method of manufacturing a semiconductor device and a semiconductor device produced thereby
- Patent Title (中): 制造半导体器件的方法和由此制造的半导体器件
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Application No.: US12280248Application Date: 2007-02-14
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Publication No.: US08802506B2Publication Date: 2014-08-12
- Inventor: Minoru Isshiki , Tomoko Kato , Yoshitsugu Morita , Hiroshi Ueki
- Applicant: Minoru Isshiki , Tomoko Kato , Yoshitsugu Morita , Hiroshi Ueki
- Applicant Address: JP Chiyoda-Ku, Tokyo
- Assignee: Dow Corning Toray Company, Ltd.
- Current Assignee: Dow Corning Toray Company, Ltd.
- Current Assignee Address: JP Chiyoda-Ku, Tokyo
- Agency: Howard & Howard Attorneys PLLC
- Priority: JP2006-046872 20060223
- International Application: PCT/JP2007/053131 WO 20070214
- International Announcement: WO2007/099823 WO 20070907
- Main IPC: H01L21/00
- IPC: H01L21/00
Abstract:
A method of manufacturing a semiconductor device sealed in a cured silicone body by placing an unsealed semiconductor device into a mold and subjecting a curable silicone composition which is fed into the space between the mold and the unsealed semiconductor device to compression molding, the method being characterized by the fact that the aforementioned curable silicone composition comprises at least the following components: (A) an epoxy-containing silicone and (B) a curing agent for an epoxy resin; can reduce warping of the semiconductor chips and circuit board, and improve surface resistance to scratching.
Public/Granted literature
- US20100213623A1 Method Of Manufacturing A Semiconductor Device And A Semiconductor Device Produced Thereby Public/Granted day:2010-08-26
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