Invention Grant
- Patent Title: Substrate processing method
- Patent Title (中): 基板加工方法
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Application No.: US13212716Application Date: 2011-08-18
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Publication No.: US08821974B2Publication Date: 2014-09-02
- Inventor: Masahiro Kimura , Tomonori Kojimaru , Tetsuya Emoto , Manabu Okutani , Masayuki Otsuji
- Applicant: Masahiro Kimura , Tomonori Kojimaru , Tetsuya Emoto , Manabu Okutani , Masayuki Otsuji
- Applicant Address: JP
- Assignee: Dainippon Screen Mfg. Co., Ltd.
- Current Assignee: Dainippon Screen Mfg. Co., Ltd.
- Current Assignee Address: JP
- Agency: Ostrolenk Faber LLP
- Priority: JP2010-185415 20100820; JP2011-071590 20110329; JP2011-099529 20110427
- Main IPC: C23C16/00
- IPC: C23C16/00 ; B05D3/02

Abstract:
A liquid hydrophobizing agent is supplied to a substrate and a surface of the substrate is hydrophobized. A solvent, lower in surface tension than water and capable of dissolving the hydrophobizing agent, is supplied to the substrate in a pre-drying rinsing step. Thereafter, the substrate is dried. The substrate to be processed is maintained in a state of not contacting water until it is dried after being hydrophobized.
Public/Granted literature
- US20120045581A1 SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS Public/Granted day:2012-02-23
Information query
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