Invention Grant
US08824152B2 Cover for a frame for a device mounted above a printed circuit board in an electronic device
有权
用于安装在电子设备中的印刷电路板上方的装置的框架的盖
- Patent Title: Cover for a frame for a device mounted above a printed circuit board in an electronic device
- Patent Title (中): 用于安装在电子设备中的印刷电路板上方的装置的框架的盖
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Application No.: US13533058Application Date: 2012-06-26
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Publication No.: US08824152B2Publication Date: 2014-09-02
- Inventor: Chao Chen , Tim Kyowski , Jason Griffin
- Applicant: Chao Chen , Tim Kyowski , Jason Griffin
- Applicant Address: CA Waterloo, Ontario
- Assignee: BlackBerry Limited
- Current Assignee: BlackBerry Limited
- Current Assignee Address: CA Waterloo, Ontario
- Agency: McCarthy Tétrault LLP
- Main IPC: H05K5/00
- IPC: H05K5/00 ; H04M1/02

Abstract:
The disclosure describes a cover for a frame for mounting a device above a printed circuit board (PCB) in an electronic device. The cover comprises: a surface to cover a bottom of the display device and to be located on top of a frame section of a frame that is mounted on the PCB and surrounds a surface device on the PCB; a raised region in the surface to allow a part of the surface device to jut above the frame section; and a depressed region in the surface to receive a feature on a bottom of the display device to allow the feature to extend into an interior cavity bounded by the frame section.
Public/Granted literature
- US20120268903A1 COVER FOR A FRAME FOR A DEVICE MOUNTED ABOVE A PRINTED CIRCUIT BOARD IN AN ELECTRONIC DEVICE Public/Granted day:2012-10-25
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