Invention Grant
US08828543B2 Conductive particles comprising complex metal layer with density gradient, method for preparing the particles, and anisotropic conductive adhesive composition comprising the particles
有权
包含具有密度梯度的复合金属层的导电颗粒，以及用于制备颗粒的方法和包含该颗粒的各向异性导电粘合剂组合物
- Patent Title: Conductive particles comprising complex metal layer with density gradient, method for preparing the particles, and anisotropic conductive adhesive composition comprising the particles
- Patent Title (中): 包含具有密度梯度的复合金属层的导电颗粒，以及用于制备颗粒的方法和包含该颗粒的各向异性导电粘合剂组合物
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Application No.: US11966040Application Date: 2007-12-28
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Publication No.: US08828543B2Publication Date: 2014-09-09
- Inventor: Tae Sub Bae , Jin Gyu Park , Jung Bae Jun , Jae Ho Lee , Jung Il Park , Sang Woon Lee
- Applicant: Tae Sub Bae , Jin Gyu Park , Jung Bae Jun , Jae Ho Lee , Jung Il Park , Sang Woon Lee
- Applicant Address: KR Gumi-si
- Assignee: Cheil Industries Inc.
- Current Assignee: Cheil Industries Inc.
- Current Assignee Address: KR Gumi-si
- Agency: Additon, Higgins & Pendleton, P.A.
- Priority: KR10-2005-0060225 20050705
- Main IPC: B32B5/16
- IPC: B32B5/16 ; B05D3/04 ; H05K3/32
Abstract:
Disclosed herein are anisotropic conductive particles having superior electrical reliability which are useful as materials for electrical connection structures. Further disclosed is a method for preparing conductive particles comprising polymer resin base particles and a conductive complex metal plating layer formed on the surface of the base particles wherein the conductive complex metal plating layer has a substantially continuous density gradient and can include nickel (Ni) and gold (Au).
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