Invention Grant
- Patent Title: Semiconductor devices with minimized current flow differences and methods of same
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Application No.: US14193752Application Date: 2014-02-28
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Publication No.: US08829573B2Publication Date: 2014-09-09
- Inventor: John V. Veliadis
- Applicant: Northrop Grumman Systems Corporation
- Applicant Address: US CA Los Angeles
- Assignee: Northrop Grumman Systems Corporation
- Current Assignee: Northrop Grumman Systems Corporation
- Current Assignee Address: US CA Los Angeles
- Agency: Andrews Kurth LLP
- Agent Sean S. Wooden; Matthew J. Esserman
- Main IPC: H01L29/80
- IPC: H01L29/80 ; H01L29/16 ; H01L29/20 ; H01L29/808

Abstract:
A semiconductor device with minimized current flow differences and method of fabricating same are disclosed. The method includes forming a semiconductor stack including a plurality of layers that include a first layer having a first conductivity type and a second layer having a first conductivity type, in which the second layer is on top of the first layer, forming a plurality of mesas in the semiconductor layer stack, and forming a plurality of gates in the semiconductor layer stack having a second conductivity type and situated partially at a periphery of the mesas, in which the plurality of gates are formed to minimize current flow differences between a current flowing from the first layer to the plurality of mesas at a first applied gate bias and a current flowing from the first layer to the plurality of mesas at a second applied gate bias when voltage is applied to the semiconductor device.
Public/Granted literature
- US20140175460A1 SEMICONDUCTOR DEVICES WITH MINIMIZED CURRENT FLOW DIFFERENCES AND METHODS OF SAME Public/Granted day:2014-06-26
Information query
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