Invention Grant
- Patent Title: Stacked LED device with diagonal bonding pads
- Patent Title (中): 堆叠的LED器件与对角焊盘
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Application No.: US13450682Application Date: 2012-04-19
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Publication No.: US08835948B2Publication Date: 2014-09-16
- Inventor: Yuan-Hsiao Chang , Yi-An Lu
- Applicant: Yuan-Hsiao Chang , Yi-An Lu
- Applicant Address: KY Grand Cayman
- Assignee: Phostek, Inc.
- Current Assignee: Phostek, Inc.
- Current Assignee Address: KY Grand Cayman
- Agency: Huffman Law Group, PC
- Main IPC: H01L29/201
- IPC: H01L29/201 ; H01L33/00

Abstract:
A semiconductor light emitting device includes a substrate and a first epitaxial structure over the substrate. The first epitaxial structure includes a first doped layer, a first light emitting layer, and a second doped layer. A first electrode is coupled to the first doped layer. A second electrode is coupled to the second doped layer facing the same direction as the first electrode. A second epitaxial structure includes a third doped layer, a second light emitting layer, and a fourth doped layer. A third electrode is coupled to the third doped layer facing the same direction as the first electrode. A fourth electrode is coupled to the fourth doped layer facing the same direction as the first electrode. An adhesive layer is between the first epitaxial structure and the second epitaxial structure.
Public/Granted literature
- US20130277692A1 STACKED LED DEVICE WITH DIAGONAL BONDING PADS Public/Granted day:2013-10-24
Information query
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