Invention Grant
- Patent Title: High-throughput printing of semiconductor precursor layer from microflake particles
- Patent Title (中): 从微片颗粒高通量印制半导体前体层
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Application No.: US12175945Application Date: 2008-07-18
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Publication No.: US08846141B1Publication Date: 2014-09-30
- Inventor: Matthew R. Robinson , Jeroen K. J. Van Duren , Craig Leidholm , Brian M. Sager
- Applicant: Matthew R. Robinson , Jeroen K. J. Van Duren , Craig Leidholm , Brian M. Sager
- Applicant Address: KY Grand Cayman
- Assignee: aeris CAPITAL Sustainable IP Ltd.
- Current Assignee: aeris CAPITAL Sustainable IP Ltd.
- Current Assignee Address: KY Grand Cayman
- Agency: JDI Patent
- Agent Joshua D. Isenberg
- Main IPC: B05D3/00
- IPC: B05D3/00

Abstract:
Methods and devices are provided for high-throughput printing of semiconductor precursor layer from microflake particles. In one embodiment, the method comprises of transforming non-planar or planar precursor materials in an appropriate vehicle under the appropriate conditions to create dispersions of planar particles with stoichiometric ratios of elements equal to that of the feedstock or precursor materials, even after settling. In particular, planar particles disperse more easily, form much denser coatings (or form coatings with more interparticle contact area), and anneal into fused, dense films at a lower temperature and/or time than their counterparts made from spherical nanoparticles. These planar particles may be microflakes that have a high aspect ratio. The resulting dense film formed from microflakes are particularly useful in forming photovoltaic devices.
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