Invention Grant
- Patent Title: Metrology systems and methods for high aspect ratio and large lateral dimension structures
- Patent Title (中): 高纵横比和大横向尺寸结构的计量系统和方法
-
Application No.: US13743304Application Date: 2013-01-16
-
Publication No.: US08860937B1Publication Date: 2014-10-14
- Inventor: Thaddeus Gerard Dziura , Xuefeng Liu , David Y. Wang , Jonathan Madsen , Alexander Kuznetsov , Johannes D. de Veer , Shankar Krishnan , Derrick Shaughnessy , Andrei Shchegrov
- Applicant: KLA-Tencor Corporation
- Applicant Address: US CA Milpitas
- Assignee: KLA-Tencor Corp.
- Current Assignee: KLA-Tencor Corp.
- Current Assignee Address: US CA Milpitas
- Agent Ann Marie Mewherter
- Main IPC: G01N21/00
- IPC: G01N21/00 ; G01N21/47
Abstract:
Various metrology systems and methods for high aspect ratio and large lateral dimension structures are provided. One method includes directing light to one or more structures formed on a wafer. The light includes ultraviolet light, visible light, and infrared light. The one or more structures include at least one high aspect ratio structure or at least one large lateral dimension structure. The method also includes generating output responsive to light from the one or more structures due to the light directed to the one or more structures. In addition, the method includes determining one or more characteristics of the one or more structures using the output.
Information query
