Invention Grant
- Patent Title: Lid attach process
- Patent Title (中): 盖附件过程
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Application No.: US13952392Application Date: 2013-07-26
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Publication No.: US08865527B2Publication Date: 2014-10-21
- Inventor: Seah Sun Too , Maxat Touzelbaev , Janet Kirkland
- Applicant: Seah Sun Too , Maxat Touzelbaev , Janet Kirkland
- Applicant Address: US CA Sunnyvale
- Assignee: Advanced Micro Devices, Inc.
- Current Assignee: Advanced Micro Devices, Inc.
- Current Assignee Address: US CA Sunnyvale
- Agent Timothy M. Honeycutt
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L21/50 ; H01L23/10 ; H01L23/42 ; H01L23/00
Abstract:
Various methods of attaching a lid to an integrated circuit substrate are provided. In one aspect, a method of attaching a lid to a substrate that has an integrated circuit positioned thereon is provided. An adhesive is applied to the substrate and an indium film is applied to the integrated circuit. The lid is positioned on the adhesive. The adhesive is partially hardened and the indium film is reflowed. The adhesive is cured.
Public/Granted literature
- US20130309814A1 LID ATTACH PROCESS Public/Granted day:2013-11-21
Information query
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