Invention Grant
- Patent Title: Small, adaptable, real-time, scalable image processing chip
- Patent Title (中): 小型,适应性强,实时,可扩展的图像处理芯片
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Application No.: US14067026Application Date: 2013-10-30
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Publication No.: US08869086B1Publication Date: 2014-10-21
- Inventor: Gene D. Tener , Mark A. Goodnough , Jennifer K. Park , Walter David Borowski
- Applicant: Lockheed Martin Corporation
- Applicant Address: US MD Bethesda
- Assignee: Lockheed Martin Corporation
- Current Assignee: Lockheed Martin Corporation
- Current Assignee Address: US MD Bethesda
- Agency: Withrow & Terranova, PLLC
- Main IPC: G06F17/50
- IPC: G06F17/50 ; G06T1/20

Abstract:
An imaging solution that uses a small, adaptable, real-time, scalable, image-processing (SMARTS IP) chip configured to function like any one of a wide range of specialized FPA imaging devices, and a method for configuring and implementing same is provided. Configuration for a wide range of applications and implementations, including ones with or without IDCA assemblies or other types of dewar/cooler structures, is disclosed. A wide range of output data formats, including all SDI-compatible image data formats, may be accomplished. Frame stacking and variable effective resolution and charge well depth levels may be accomplished in output image data based on on-chip image processing techniques. On-chip image processing algorithms may include XR™, DRC, NUC, and other similar or related techniques. Image data output compression through on-chip processing is also disclosed.
Public/Granted literature
- US1713677A Process of soldering and product thereof Public/Granted day:1929-05-21
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