Invention Grant
- Patent Title: Mask pattern and correcting method thereof
- Patent Title (中): 掩模图案及其校正方法
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Application No.: US13337376Application Date: 2011-12-27
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Publication No.: US08885917B2Publication Date: 2014-11-11
- Inventor: Te-Hsien Hsieh , Ming-Jui Chen , Cheng-Te Wang , Jing-Yi Lee
- Applicant: Te-Hsien Hsieh , Ming-Jui Chen , Cheng-Te Wang , Jing-Yi Lee
- Applicant Address: TW Hsinchu
- Assignee: United Microelectronics Corp.
- Current Assignee: United Microelectronics Corp.
- Current Assignee Address: TW Hsinchu
- Agency: WPAT, PC
- Agent Justin King
- Main IPC: G06K9/00
- IPC: G06K9/00

Abstract:
A mask pattern and a correcting method thereof are provided. The correcting method includes the following steps. An original pattern having a first original contour and a second original contour is provided. The first original contour has a first original corner. The second original contour has a second original corner, which is near the first original corner. The first and second original corners are cut to form a cut pattern. An optical proximity correction (OPC) process is applied to the cut pattern to form the mask pattern.
Public/Granted literature
- US20130163850A1 MASK PATTERN AND CORRECTING METHOD THEREOF Public/Granted day:2013-06-27
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