Invention Grant
- Patent Title: Semiconductor device
- Patent Title (中): 半导体器件
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Application No.: US13892324Application Date: 2013-05-13
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Publication No.: US08890218B2Publication Date: 2014-11-18
- Inventor: Chu-Chun Chang , Chun-Mao Chiou , Chiu-Te Lee
- Applicant: United Microelectronics Corp.
- Applicant Address: TW Science-Based Industrial Park, Hsin-Chu
- Assignee: United Microelectronics Corp.
- Current Assignee: United Microelectronics Corp.
- Current Assignee Address: TW Science-Based Industrial Park, Hsin-Chu
- Agent Winston Hsu; Scott Margo
- Main IPC: H01L29/76
- IPC: H01L29/76 ; H01L29/78 ; H01L29/49 ; H01L29/66 ; H01L21/8238

Abstract:
A semiconductor device is disclosed. The semiconductor device includes: a substrate; a gate structure disposed on the substrate; a first spacer disposed on a sidewall of the gate structure; a second spacer disposed around the first spacer, wherein the second spacer comprises a L-shaped cap layer and a cap layer on the L-shaped cap layer; a source/drain disposed in the substrate adjacent to two sides of the second spacer; and a CESL disposed on the substrate to cover the gate structure, wherein at least part of the second spacer and the CESL comprise same chemical composition and/or physical property.
Public/Granted literature
- US20130256765A1 SEMICONDUCTOR DEVICE Public/Granted day:2013-10-03
Information query
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