Invention Grant
- Patent Title: Multi-chip module with self-populating positive features
- Patent Title (中): 多芯片模块具有自我填充的积极特点
-
Application No.: US13838602Application Date: 2013-03-15
-
Publication No.: US08896112B2Publication Date: 2014-11-25
- Inventor: Hiren D. Thacker , Ashok V. Krishnamoorthy , John E. Cunningham , Chaoqi Zhang
- Applicant: Oracle International Corporation
- Applicant Address: US CA Redwood Shores
- Assignee: Oracle International Corporation
- Current Assignee: Oracle International Corporation
- Current Assignee Address: US CA Redwood Shores
- Agency: Park, Vaughan, Fleming & Dowler LLP
- Agent Steven E. Stupp
- Main IPC: H01L23/02
- IPC: H01L23/02 ; H01L23/48 ; H01L23/52 ; H01L29/40 ; H01L23/00
Abstract:
A multi-chip module (MCM) is described. This MCM includes at least two substrates that are mechanically coupled and aligned by positive and negative features on facing surfaces of the substrates. These positive and negative features may mate and self-lock with each other. The positive features may be self-populated into the negative features on at least one of the substrates using a hydrophilic layer in the negative feature. This hydrophilic layer may be used in conjunction with a hydrophobic layer surrounding the negative features on a top surface of at least one of the substrates.
Public/Granted literature
- US20140264854A1 MULTI-CHIP MODULE WITH SELF-POPULATING POSITIVE FEATURES Public/Granted day:2014-09-18
Information query
IPC分类:
