Invention Grant
- Patent Title: Substrate treatment apparatus and substrate treatment method
- Patent Title (中): 基板处理装置及基板处理方法
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Application No.: US12722135Application Date: 2010-03-11
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Publication No.: US08899172B2Publication Date: 2014-12-02
- Inventor: Koji Hashimoto
- Applicant: Koji Hashimoto
- Applicant Address: JP
- Assignee: SCREEN Holdings Co., Ltd.
- Current Assignee: SCREEN Holdings Co., Ltd.
- Current Assignee Address: JP
- Agency: Ostrolenk Faber LLP
- Priority: JP2009-082841 20090330; JP2009-082842 20090330
- Main IPC: B05C11/08
- IPC: B05C11/08 ; B05B3/00 ; H01L21/67 ; B05C5/02 ; B05C11/02 ; B05C11/04

Abstract:
A substrate treatment apparatus includes: a substrate holding unit which horizontally holds a substrate; a substrate rotating unit which rotates the substrate held by the substrate holding unit about a vertical axis; a treatment liquid supplying unit which supplies a treatment liquid to an upper surface of the substrate held by the substrate holding unit; an opposing member to be located in opposed spaced relation to the upper surface of the substrate held by the substrate holding unit in contact with a film of the treatment liquid formed on the upper surface of the substrate so as to receive a lift force from the liquid film; a support member which supports the opposing member; and an opposing member holding mechanism which causes the support member to hold the opposing member in a vertically relatively movable manner.
Public/Granted literature
- US20100247761A1 SUBSTRATE TREATMENT APPARATUS AND SUBSTRATE TREATMENT METHOD Public/Granted day:2010-09-30
Information query
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