Invention Grant
- Patent Title: Electronic interconnect system
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Application No.: US13573964Application Date: 2012-10-17
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Publication No.: US08902606B2Publication Date: 2014-12-02
- Inventor: James E. Clayton , Zakaryae Fathi
- Applicant: James E. Clayton , Zakaryae Fathi
- Applicant Address: US NC Research Triangle Park
- Assignee: Microelectronics Assembly Technologies
- Current Assignee: Microelectronics Assembly Technologies
- Current Assignee Address: US NC Research Triangle Park
- Agent Robert J. Lauf
- Main IPC: H05K7/00
- IPC: H05K7/00 ; G06F1/16

Abstract:
An electronic interconnect system comprises: a motherboard having electrical contacts on its upper and lower surfaces along a selected edge; an electronic module comprising a circuit board with electronic devices mounted thereon, and further comprising two opposing flexible portions that are openable outwardly from one another, the flexible portions having electrical contact pads on the opposing surfaces, so that when the flexible portions are placed on either side of the edge of the motherboard the pads align with contacts on the respective surfaces of the motherboard and make electrical contact therewith.
Public/Granted literature
- US20140104766A1 Electronic interconnect system Public/Granted day:2014-04-17
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