Invention Grant
- Patent Title: System and method for picking and placement of chip dies
- Patent Title (中): 芯片芯片拾取和放置的系统和方法
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Application No.: US13520674Application Date: 2011-01-06
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Publication No.: US08925186B2Publication Date: 2015-01-06
- Inventor: Erwin John Van Zwet , Léon Van Dooren , Adrianus Johannes Petrus Maria Vermeer , Kees Moddemeijer
- Applicant: Erwin John Van Zwet , Léon Van Dooren , Adrianus Johannes Petrus Maria Vermeer , Kees Moddemeijer
- Applicant Address: NL Delft
- Assignee: Nederlandse Organisatie voor Toegepast-Natuurwetenschappelijk Onderzoek TNO
- Current Assignee: Nederlandse Organisatie voor Toegepast-Natuurwetenschappelijk Onderzoek TNO
- Current Assignee Address: NL Delft
- Agency: Hoffmann & Baron, LLP
- Priority: EP10150279 20100107
- International Application: PCT/NL2011/050010 WO 20110106
- International Announcement: WO2011/084058 WO 20110714
- Main IPC: B23P19/00
- IPC: B23P19/00 ; B25J9/16 ; G05B19/401 ; H01L21/68

Abstract:
According to an aspect of the invention, there is provided a chip die 2 manipulator apparatus arranged for picking and placing of a chip die 2 in a chip manufacturing process, wherein an imaging system 11 comprising an arc form convex spherical mirror 13 arranged at a second off-axis position B and centered relative to the center position 5; a folding mirror 4 arranged in a light path between the convex spherical mirror 13 and the center position 5 for folding the light path to a third off-axis position C; and an arc form concave spherical mirror 15 arranged at the third off-axis position C having a curvature to image from at least one of the center position 5 and the component 2 on the image detection system 9. The imaging system 11 corrects for the angled image detection of the center position 5.
Public/Granted literature
- US20130004269A1 System and Method for Picking and Placement of Chip Dies Public/Granted day:2013-01-03
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