Invention Grant
US08925186B2 System and method for picking and placement of chip dies 有权
芯片芯片拾取和放置的系统和方法

System and method for picking and placement of chip dies
Abstract:
According to an aspect of the invention, there is provided a chip die 2 manipulator apparatus arranged for picking and placing of a chip die 2 in a chip manufacturing process, wherein an imaging system 11 comprising an arc form convex spherical mirror 13 arranged at a second off-axis position B and centered relative to the center position 5; a folding mirror 4 arranged in a light path between the convex spherical mirror 13 and the center position 5 for folding the light path to a third off-axis position C; and an arc form concave spherical mirror 15 arranged at the third off-axis position C having a curvature to image from at least one of the center position 5 and the component 2 on the image detection system 9. The imaging system 11 corrects for the angled image detection of the center position 5.
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