Invention Grant
- Patent Title: Stem with pressfit porous element
- Patent Title (中): 带压力多孔元件
-
Application No.: US13966989Application Date: 2013-08-14
-
Publication No.: US08926708B2Publication Date: 2015-01-06
- Inventor: Damon J. Servidio , G. Douglas Letson
- Applicant: Howmedica Osteonics Corp.
- Applicant Address: US NJ Mahwah
- Assignee: Howmedica Osteonics Corp.
- Current Assignee: Howmedica Osteonics Corp.
- Current Assignee Address: US NJ Mahwah
- Agency: Lerner, David, Littenberg, Krumholz & Mentlik, LLP
- Main IPC: A61F2/30
- IPC: A61F2/30 ; A61F2/36 ; A61F2/38

Abstract:
An implant assembly comprises a stem and an augment. The augment includes a porous outer region which is integrally formed onto a solid inner region. The augment further includes, solid posts integrally formed on the solid inner region and extend through the porous outer region to the outer surface of the augment. The posts are integrally formed with and surrounded by the porous region and are designed to allow assembly of the augment to the stem without damaging the structure of the porous region. A method of attaching the augment is described, wherein a tool is designed to grip to posts of the augment and apply loads through these posts during assembly.
Public/Granted literature
- US20130326859A1 STEM WITH PRESSFIT POROUS ELEMENT Public/Granted day:2013-12-12
Information query
IPC分类: